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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
XR2C-0311-N

XR2C-0311-N

CONN SOCKET SIP 3POS GOLD

Omron Electronics Inc-EMC Div

2556 0.60
- +

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XR2C-0311-N

Datenblatt

Bulk XR2 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-1401-N

XR2A-1401-N

CONN IC DIP SOCKET 14POS GOLD

Omron Electronics Inc-EMC Div

451 2.71
- +

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XR2A-1401-N

Datenblatt

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-2011-N

XR2C-2011-N

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

612 3.06
- +

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XR2C-2011-N

Datenblatt

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-0802

XR2A-0802

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

247 3.60
- +

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XR2A-0802

Datenblatt

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C1011N

XR2C1011N

CONN SOCKET SIP 10POS GOLD

Omron Electronics Inc-EMC Div

353 2.28
- +

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XR2C1011N

Datenblatt

Bulk XR2 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2A-0825

XR2A-0825

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

252 2.09
- +

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XR2A-0825

Datenblatt

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-1411-N

XR2A-1411-N

CONN IC DIP SOCKET 14POS GOLD

Omron Electronics Inc-EMC Div

2495 2.63
- +

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XR2A-1411-N

Datenblatt

Tube XR2 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-1801-N

XR2A-1801-N

CONN IC DIP SOCKET 18POS GOLD

Omron Electronics Inc-EMC Div

2833 3.10
- +

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XR2A-1801-N

Datenblatt

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2P2041

XR2P2041

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

100 8.12
- +

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XR2P2041

Datenblatt

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2A-0815

XR2A-0815

CONNECTORS - CONNECTOR

Omron Electronics Inc-EMC Div

107 0.89
- +

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XR2A-0815

Datenblatt

Box * Active - - - - - - - - - - - - - -
XR2A-1611-N

XR2A-1611-N

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

2723 2.55
- +

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XR2A-1611-N

Datenblatt

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-2411-N

XR2A-2411-N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

3395 4.45
- +

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XR2A-2411-N

Datenblatt

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-3201-N

XR2A-3201-N

CONN IC DIP SOCKET 32POS GOLD

Omron Electronics Inc-EMC Div

3308 6.35
- +

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XR2A-3201-N

Datenblatt

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-2005

XR2C-2005

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

2646 5.54
- +

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XR2C-2005

Datenblatt

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A0815

XR2A0815

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

3289 1.95
- +

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XR2A0815

Datenblatt

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2C-3205

XR2C-3205

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div

2960 7.77
- +

In den Warenkorb

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XR2C-3205

Datenblatt

Bulk,Box XR2 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-0811-N

XR2A-0811-N

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

3037 0.96
- +

In den Warenkorb

Jetzt anfragen

XR2A-0811-N

Datenblatt

Bulk,Box XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-1611-N

XR2C-1611-N

CONN SOCKET SIP 16POS GOLD

Omron Electronics Inc-EMC Div

3098 1.34
- +

In den Warenkorb

Jetzt anfragen

XR2C-1611-N

Datenblatt

Bulk,Box XR2 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-1501-N

XR2C-1501-N

CONN SOCKET SIP 15POS GOLD

Omron Electronics Inc-EMC Div

2830 2.29
- +

In den Warenkorb

Jetzt anfragen

XR2C-1501-N

Datenblatt

Bulk XR2 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-1601-N

XR2A-1601-N

IC CONNECTOR

Omron Electronics Inc-EMC Div

3324 2.83
- +

In den Warenkorb

Jetzt anfragen

Bulk * Active - - - - - - - - - - - - - -
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