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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-87-432-41-117101

114-87-432-41-117101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3611 1.33
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114-87-432-41-117101

Datenblatt

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-008101

116-87-316-41-008101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3239 1.33
- +

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116-87-316-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-003101

116-87-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3363 1.33
- +

In den Warenkorb

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116-87-322-41-003101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-322-41-003101

115-83-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3096 1.33
- +

In den Warenkorb

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115-83-322-41-003101

Datenblatt

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-422-41-003101

115-83-422-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3393 1.33
- +

In den Warenkorb

Jetzt anfragen

115-83-422-41-003101

Datenblatt

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-006101

116-87-624-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3677 1.51
- +

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116-87-624-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-006101

116-87-324-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2207 1.34
- +

In den Warenkorb

Jetzt anfragen

116-87-324-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-2513-10

06-2513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2001 1.42
- +

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06-2513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6513-10T

06-6513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3386 1.42
- +

In den Warenkorb

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06-6513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0518-10T

10-0518-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2925 1.42
- +

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10-0518-10T

Datenblatt

Bulk 518 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-10T

10-1518-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2470 1.42
- +

In den Warenkorb

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10-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-10

11-0518-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3572 1.42
- +

In den Warenkorb

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11-0518-10

Datenblatt

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0517-90C

03-0517-90C

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2452 1.42
- +

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03-0517-90C

Datenblatt

Bulk 0517 Active SIP 3 (1 x 3) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-318-41-006101

116-83-318-41-006101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3543 1.34
- +

In den Warenkorb

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116-83-318-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-420-41-001101

612-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2361 1.35
- +

In den Warenkorb

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612-87-420-41-001101

Datenblatt

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-001101

116-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3175 1.36
- +

In den Warenkorb

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116-87-314-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 32-HZL/07-TT

AR 32-HZL/07-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components

2793 1.44
- +

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AR 32-HZL/07-TT

Datenblatt

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
08-3513-10

08-3513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2439 1.44
- +

In den Warenkorb

Jetzt anfragen

08-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0513-10

08-0513-10

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3817 1.44
- +

In den Warenkorb

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08-0513-10

Datenblatt

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-210-41-011101

116-87-210-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3769 1.39
- +

In den Warenkorb

Jetzt anfragen

116-87-210-41-011101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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