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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-320-41-105191

110-83-320-41-105191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3790 1.65
- +

In den Warenkorb

Jetzt anfragen

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-018101

116-87-328-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3750 1.60
- +

In den Warenkorb

Jetzt anfragen

116-87-328-41-018101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-108-41-013000

346-93-108-41-013000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

3379 1.72
- +

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346-93-108-41-013000

Datenblatt

Tube 346 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-108-41-013000

346-43-108-41-013000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

3647 1.72
- +

In den Warenkorb

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346-43-108-41-013000

Datenblatt

Tube 346 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-432-41-001101

614-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2097 1.60
- +

In den Warenkorb

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614-87-432-41-001101

Datenblatt

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-328-31-012101

614-87-328-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3546 1.61
- +

In den Warenkorb

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614-87-328-31-012101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-068-24-008

540-88-068-24-008

CONN SOCKET PLCC 68POS TIN

Preci-Dip

3436 1.61
- +

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540-88-068-24-008

Datenblatt

Bulk 540 Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-83-316-41-002101

116-83-316-41-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2543 1.61
- +

In den Warenkorb

Jetzt anfragen

116-83-316-41-002101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-640-41-005101

117-87-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2407 1.61
- +

In den Warenkorb

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117-87-640-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-0518-10

14-0518-10

14 PIN SOCKET

Aries Electronics

2405 1.73
- +

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- 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0513-10H

07-0513-10H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2804 1.73
- +

In den Warenkorb

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07-0513-10H

Datenblatt

Bulk 0513 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-1518-10

14-1518-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2807 1.73
- +

In den Warenkorb

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14-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-43-424-41-001000

110-43-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3620 1.73
- +

In den Warenkorb

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110-43-424-41-001000

Datenblatt

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-422-41-012101

116-87-422-41-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3681 1.62
- +

In den Warenkorb

Jetzt anfragen

116-87-422-41-012101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-324-41-001101

614-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3546 1.63
- +

In den Warenkorb

Jetzt anfragen

614-83-324-41-001101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-424-41-001101

614-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2685 1.63
- +

In den Warenkorb

Jetzt anfragen

614-83-424-41-001101

Datenblatt

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-6513-10

08-6513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2787 1.76
- +

In den Warenkorb

Jetzt anfragen

08-6513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0513-10

10-0513-10

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3878 1.76
- +

In den Warenkorb

Jetzt anfragen

10-0513-10

Datenblatt

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0513-10T

11-0513-10T

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3033 1.76
- +

In den Warenkorb

Jetzt anfragen

11-0513-10T

Datenblatt

Bulk 0513 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-322-41-007101

116-87-322-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3528 1.75
- +

In den Warenkorb

Jetzt anfragen

116-87-322-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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