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Mfr. Teil #	Lagerbestand	Preis	Menge	Datenblatt	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
110-83-632-41-105101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	2501	2.44	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	110	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-3518-11 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2702	2.61	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-2511-10 10-PIN SOLDER TAIL IC SOCKET Aries Electronics	2007	2.61	- + In den Warenkorb Jetzt anfragen		-	511	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
20-4518-10 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3929	2.61	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
09-0518-11H CONN SOCKET SIP 9POS GOLD Aries Electronics	3625	2.61	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	SIP	9 (1 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-081-12-071101 CONN SOCKET PGA 81POS GOLD Preci-Dip	2338	2.44	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	510	Active	PGA	81 (12 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-006101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2814	2.45	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-003101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3058	2.69	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-642-41-001101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	2846	2.46	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	110	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-628-41-105101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3057	2.46	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	117	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.070 (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-642-41-001101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	2747	2.47	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	614	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-3518-00 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2562	2.57	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-6513-10H CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2571	2.63	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.6 (15.24mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
22-4518-10T CONN IC DIP SOCKET 22POS GOLD Aries Electronics	3167	2.63	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
21-0518-10T CONN SOCKET SIP 21POS GOLD Aries Electronics	2121	2.63	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	SIP	21 (1 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
23-0518-10 CONN SOCKET SIP 23POS GOLD Aries Electronics	3105	2.63	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	SIP	23 (1 x 23)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
117-87-656-41-005101 CONN IC DIP SOCKET 56POS GOLD Preci-Dip	3162	2.48	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	117	Active	DIP, 0.6 (15.24mm) Row Spacing	56 (2 x 28)	0.070 (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-109-31-018000 CONN SOCKET SIP 9POS GOLD Mill-Max Manufacturing Corp.	2495	2.64	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	714	Active	SIP	9 (1 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-640-41-006101 CONN IC DIP SOCKET 40POS GOLD Preci-Dip	2989	2.52	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-316-11-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	3461	2.52	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	299	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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