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Mfr. Teil #	Lagerbestand	Preis	Menge	Datenblatt	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-87-133-13-043101 CONN SOCKET PGA 133POS GOLD Preci-Dip	2583	4.01	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	510	Active	PGA	133 (13 x 13)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-003101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	3955	4.03	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-3513-10 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2029	4.22	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
146-87-642-41-035101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	2279	4.04	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	146	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-642-41-036101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	3309	4.04	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	146	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-652-41-001101 CONN IC DIP SOCKET 52POS GOLD Preci-Dip	3707	4.04	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	614	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-656-41-105101 CONN IC DIP SOCKET 56POS GOLD Preci-Dip	2606	4.05	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	117	Active	DIP, 0.6 (15.24mm) Row Spacing	56 (2 x 28)	0.070 (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-C280-10 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	3912	4.24	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	EJECT-A-DIP™	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-3503-20 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3743	4.24	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	503	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
08-3503-30 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2977	4.24	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	503	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
14-C195-10 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	3654	4.24	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	EJECT-A-DIP™	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-2823-90T CONN IC DIP SOCKET 8POS TIN Aries Electronics	3342	4.24	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	Vertisockets™ 800	Active	DIP, 0.2 (5.08mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
111-43-640-41-001000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	3747	4.27	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	111	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-132-14-071101 CONN SOCKET PGA 132POS GOLD Preci-Dip	2709	4.10	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	510	Active	PGA	132 (14 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
19-0513-10H CONN SOCKET SIP 19POS GOLD Aries Electronics	2305	4.36	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	0513	Active	SIP	19 (1 x 19)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
15-0518-11H CONN SOCKET SIP 15POS GOLD Aries Electronics	3396	4.36	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	SIP	15 (1 x 15)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
42-1518-10T CONN IC DIP SOCKET 42POS GOLD Aries Electronics	2064	4.36	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-650-41-006101 CONN IC DIP SOCKET 50POS GOLD Preci-Dip	2133	4.37	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-011101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2471	4.23	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-011101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3959	4.35	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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