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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-181-15-051101

510-87-181-15-051101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3134 5.46
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510-87-181-15-051101

Datenblatt

Bulk 510 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-181-17-001101

510-87-181-17-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3151 5.46
- +

In den Warenkorb

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510-87-181-17-001101

Datenblatt

Bulk 510 Active PGA 181 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-181-17-082101

510-87-181-17-082101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

2353 5.46
- +

In den Warenkorb

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510-87-181-17-082101

Datenblatt

Bulk 510 Active PGA 181 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-3518-10E

14-3518-10E

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2311 5.79
- +

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14-3518-10E

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0518-00

22-0518-00

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2499 5.79
- +

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22-0518-00

Datenblatt

Bulk 518 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-1518-00

22-1518-00

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3559 5.79
- +

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22-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-83-952-41-001101

612-83-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2299 5.47
- +

In den Warenkorb

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612-83-952-41-001101

Datenblatt

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
30-6511-10

30-6511-10

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

2819 5.81
- +

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30-6511-10

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7400-11

02-7400-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3196 5.81
- +

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02-7400-11

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-7425-11

02-7425-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3523 5.81
- +

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02-7425-11

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6513-10

30-6513-10

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2029 5.81
- +

In den Warenkorb

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30-6513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-114-13-062101

510-83-114-13-062101

CONN SOCKET PGA 114POS GOLD

Preci-Dip

3576 5.46
- +

In den Warenkorb

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510-83-114-13-062101

Datenblatt

Bulk 510 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-181-15-001101

510-87-181-15-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3793 5.46
- +

In den Warenkorb

Jetzt anfragen

510-87-181-15-001101

Datenblatt

Bulk 510 Active PGA 181 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-008101

116-87-652-41-008101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2238 5.48
- +

In den Warenkorb

Jetzt anfragen

116-87-652-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
28-3513-10

28-3513-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3810 5.82
- +

In den Warenkorb

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28-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-650-41-001101

116-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2335 6.13
- +

In den Warenkorb

Jetzt anfragen

116-87-650-41-001101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-648-41-035101

146-83-648-41-035101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2244 5.49
- +

In den Warenkorb

Jetzt anfragen

146-83-648-41-035101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-648-41-036101

146-83-648-41-036101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2216 5.49
- +

In den Warenkorb

Jetzt anfragen

146-83-648-41-036101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-182-18-091101

510-87-182-18-091101

CONN SOCKET PGA 182POS GOLD

Preci-Dip

2348 5.49
- +

In den Warenkorb

Jetzt anfragen

510-87-182-18-091101

Datenblatt

Bulk 510 Active PGA 182 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
17-0513-11H

17-0513-11H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3092 5.82
- +

In den Warenkorb

Jetzt anfragen

17-0513-11H

Datenblatt

Bulk 0513 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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