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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-3501-30

16-3501-30

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2703 6.13
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16-3501-30

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-101

24-6518-101

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3047 6.13
- +

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24-6518-101

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-328-41-013101

116-87-328-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3129 5.81
- +

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116-87-328-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-013101

116-87-428-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2503 5.81
- +

In den Warenkorb

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116-87-428-41-013101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-192-17-081101

510-87-192-17-081101

CONN SOCKET PGA 192POS GOLD

Preci-Dip

3127 5.79
- +

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510-87-192-17-081101

Datenblatt

Bulk 510 Active PGA 192 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-125-13-041101

510-83-125-13-041101

CONN SOCKET PGA 125POS GOLD

Preci-Dip

2126 5.80
- +

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510-83-125-13-041101

Datenblatt

Bulk 510 Active PGA 125 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-008101

116-83-648-41-008101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3251 6.51
- +

In den Warenkorb

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116-83-648-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
35-0518-11

35-0518-11

CONN SOCKET SIP 35POS GOLD

Aries Electronics

3877 6.16
- +

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35-0518-11

Datenblatt

Bulk 518 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-102

18-3518-102

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3630 6.16
- +

In den Warenkorb

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18-3518-102

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-00

40-6513-00

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2521 6.16
- +

In den Warenkorb

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40-6513-00

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-648-41-011101

116-87-648-41-011101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3713 6.52
- +

In den Warenkorb

Jetzt anfragen

116-87-648-41-011101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-131-41-013000

346-93-131-41-013000

CONN SOCKET SIP 31POS GOLD

Mill-Max Manufacturing Corp.

3002 6.17
- +

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346-93-131-41-013000

Datenblatt

Bulk 346 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-131-41-013000

346-43-131-41-013000

CONN SOCKET SIP 31POS GOLD

Mill-Max Manufacturing Corp.

3870 6.17
- +

In den Warenkorb

Jetzt anfragen

346-43-131-41-013000

Datenblatt

Bulk 346 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-121-31-018000

714-43-121-31-018000

CONN SOCKET SIP 21POS GOLD

Mill-Max Manufacturing Corp.

2345 6.17
- +

In den Warenkorb

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714-43-121-31-018000

Datenblatt

Bulk 714 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6518-11

32-6518-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2113 6.17
- +

In den Warenkorb

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32-6518-11

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-7350-10

04-7350-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3533 6.18
- +

In den Warenkorb

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04-7350-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7360-10

04-7360-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3327 6.18
- +

In den Warenkorb

Jetzt anfragen

04-7360-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7375-10

04-7375-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2032 6.18
- +

In den Warenkorb

Jetzt anfragen

04-7375-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7380-10

04-7380-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2183 6.18
- +

In den Warenkorb

Jetzt anfragen

04-7380-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7400-10

04-7400-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2816 6.18
- +

In den Warenkorb

Jetzt anfragen

04-7400-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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