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Mfr. Teil #	Lagerbestand	Preis	Menge	Datenblatt	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
38-6511-10 CONN IC DIP SOCKET 38POS TIN Aries Electronics	3740	6.74	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	511	Active	DIP, 0.6 (15.24mm) Row Spacing	38 (2 x 19)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-101H CONN IC DIP SOCKET 24POS GOLD Aries Electronics	3418	6.74	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
15-0517-90C CONN SOCKET SIP 15POS GOLD Aries Electronics	3870	6.74	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	0517	Active	SIP	15 (1 x 15)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
117-83-668-41-105101 CONN IC DIP SOCKET 68POS GOLD Preci-Dip	3097	6.39	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	117	Active	DIP, 0.6 (15.24mm) Row Spacing	68 (2 x 34)	0.070 (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
111-93-304-41-001000 CONN IC DIP SOCKET 4POS GOLD Mill-Max Manufacturing Corp.	3875	6.77	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-304-41-105000 STANDRD SOLDRTL Mill-Max Manufacturing Corp.	2082	6.77	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-304-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2785	6.77	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	111	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-124-31-018000 CONN SOCKET SIP 24POS GOLD Mill-Max Manufacturing Corp.	3679	6.77	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	714	Active	SIP	24 (1 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-83-764-41-105101 CONN IC DIP SOCKET 64POS GOLD Preci-Dip	2042	6.40	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	117	Active	DIP, 0.75 (19.05mm) Row Spacing	64 (2 x 32)	0.070 (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-064-08-000112 CONN SOCKET PGA 64POS GOLD Preci-Dip	3172	6.40	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	614	Active	PGA	64 (8 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-009101 CONN IC DIP SOCKET 52POS GOLD Preci-Dip	3733	7.18	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2T2401N CONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div	3151	6.80	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	XR2	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Threaded	Open Frame	Solder	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled
XR2T2411N CONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div	2554	6.80	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	XR2	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Threaded	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled
214-44-624-01-670799 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	3319	6.82	- + In den Warenkorb Jetzt anfragen		Tape & Reel (TR)	214	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polyamide (PA46), Nylon 4/6
214-99-624-01-670799 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	2932	6.82	- + In den Warenkorb Jetzt anfragen		Tape & Reel (TR)	214	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polyamide (PA46), Nylon 4/6
116-83-648-41-001101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	2702	7.21	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-41-304-41-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2714	6.82	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-304-41-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3463	6.82	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-304-41-001000 CONN IC DIP SOCKET 4POS GOLD Mill-Max Manufacturing Corp.	3173	6.83	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
21-0513-11H CONN SOCKET SIP 21POS GOLD Aries Electronics	3475	6.83	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	0513	Active	SIP	21 (1 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled

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