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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
APA-422-T-N

APA-422-T-N

ADAPTER PLUG

Samtec Inc.

2575 7.31
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Tube APA Active - 22 (2 x 11) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
32-C212-10

32-C212-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2252 7.32
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32-C212-10

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0511-10

14-0511-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

3536 7.32
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14-0511-10

Datenblatt

Bulk 511 Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-820-90C

10-820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2925 7.32
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10-820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-822-90C

10-822-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2015 7.32
- +

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10-822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-237-17-061101

510-87-237-17-061101

CONN SOCKET PGA 237POS GOLD

Preci-Dip

3302 6.94
- +

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510-87-237-17-061101

Datenblatt

Bulk 510 Active PGA 237 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-126-31-018000

714-43-126-31-018000

CONN SOCKET SIP 26POS GOLD

Mill-Max Manufacturing Corp.

2464 7.33
- +

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714-43-126-31-018000

Datenblatt

Bulk 714 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-0503-21

08-0503-21

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2416 7.34
- +

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08-0503-21

Datenblatt

Bulk 0503 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
08-0503-31

08-0503-31

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2687 7.34
- +

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08-0503-31

Datenblatt

Bulk 0503 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
116-83-652-41-001101

116-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2186 7.81
- +

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116-83-652-41-001101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-640-SST

ICO-640-SST

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

2871 7.36
- +

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ICO-640-SST

Datenblatt

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
20-3501-20

20-3501-20

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3796 7.39
- +

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20-3501-20

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-3501-30

20-3501-30

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2366 7.39
- +

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20-3501-30

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-112

18-3518-112

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2444 7.39
- +

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18-3518-112

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0501-20

07-0501-20

CONN SOCKET SIP 7POS TIN

Aries Electronics

3119 7.39
- +

In den Warenkorb

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07-0501-20

Datenblatt

Bulk 501 Active SIP 7 (1 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
07-0501-30

07-0501-30

CONN SOCKET SIP 7POS TIN

Aries Electronics

2266 7.39
- +

In den Warenkorb

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07-0501-30

Datenblatt

Bulk 501 Active SIP 7 (1 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
126-41-304-41-001000

126-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3974 7.40
- +

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126-41-304-41-001000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-304-41-001000

126-91-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3071 7.40
- +

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126-91-304-41-001000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-142-15-081101

510-83-142-15-081101

CONN SOCKET PGA 142POS GOLD

Preci-Dip

3431 7.01
- +

In den Warenkorb

Jetzt anfragen

510-83-142-15-081101

Datenblatt

Bulk 510 Active PGA 142 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
38-3513-10

38-3513-10

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3942 7.41
- +

In den Warenkorb

Jetzt anfragen

38-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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