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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
12-820-90C

12-820-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3455 8.22
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12-820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-822-90C

12-822-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2022 8.22
- +

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12-822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-145-41-013000

346-93-145-41-013000

CONN SOCKET SIP 45POS GOLD

Mill-Max Manufacturing Corp.

3744 8.23
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346-93-145-41-013000

Datenblatt

Bulk 346 Active SIP 45 (1 x 45) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-145-41-013000

346-43-145-41-013000

CONN SOCKET SIP 45POS GOLD

Mill-Max Manufacturing Corp.

2657 8.23
- +

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346-43-145-41-013000

Datenblatt

Bulk 346 Active SIP 45 (1 x 45) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-304-41-008000

116-93-304-41-008000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2051 8.24
- +

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116-93-304-41-008000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-304-41-008000

116-43-304-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2283 8.24
- +

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116-43-304-41-008000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-6503-20

16-6503-20

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3263 8.24
- +

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16-6503-20

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6503-30

16-6503-30

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3467 8.24
- +

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16-6503-30

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
614-87-069-11-061112

614-87-069-11-061112

CONN SOCKET PGA 69POS GOLD

Preci-Dip

3544 7.81
- +

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614-87-069-11-061112

Datenblatt

Bulk 614 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-238-19-101101

510-87-238-19-101101

CONN SOCKET PGA 238POS GOLD

Preci-Dip

3319 7.81
- +

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510-87-238-19-101101

Datenblatt

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-314-G-A

APA-314-G-A

ADAPTER PLUG

Samtec Inc.

3965 8.29
- +

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Bulk APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
121-13-304-41-001000

121-13-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

3867 8.29
- +

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121-13-304-41-001000

Datenblatt

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-304-41-001000

612-93-304-41-001000

SOCKET CARRIER SLDRTL .300 4POS

Mill-Max Manufacturing Corp.

3441 8.29
- +

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612-93-304-41-001000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-304-41-004000

612-41-304-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3602 8.29
- +

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612-41-304-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-304-41-001000

612-43-304-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3687 8.29
- +

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612-43-304-41-001000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-304-41-004000

612-91-304-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3632 8.29
- +

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612-91-304-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-304-41-001000

123-91-304-41-001000

SOCKET IC OPEN 3 LVL .300 4POS

Mill-Max Manufacturing Corp.

3096 8.31
- +

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Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-304-41-001000

123-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2584 8.31
- +

In den Warenkorb

Jetzt anfragen

123-41-304-41-001000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-6513-11H

20-6513-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3632 8.31
- +

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20-6513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-2822-90TWR

10-2822-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

2410 8.31
- +

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10-2822-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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