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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-820-90T

16-820-90T

RT ANGLE 16 PIN SKT .1 INCH CTR

Aries Electronics

3040 9.00
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- Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-823-90C

14-823-90C

IC SOCKET 14PIN VERT SCKT HORIZ

Aries Electronics

3425 9.00
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- Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-01

16-3518-01

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2006 9.00
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16-3518-01

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-112

28-3518-112

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3754 9.00
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28-3518-112

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-112

28-6518-112

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2752 9.00
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28-6518-112

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6823-90T

16-6823-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2499 9.00
- +

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16-6823-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-822-90T

16-822-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2237 9.00
- +

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16-822-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-4820-90C

14-4820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3690 9.00
- +

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14-4820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-4823-90C

14-4823-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3740 9.00
- +

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14-4823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6820-90C

14-6820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3628 9.00
- +

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14-6820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6822-90C

14-6822-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2919 9.00
- +

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14-6822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6823-90C

14-6823-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3711 9.00
- +

In den Warenkorb

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14-6823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-820-90C

14-820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3799 9.00
- +

In den Warenkorb

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14-820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-822-90C

14-822-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3861 9.00
- +

In den Warenkorb

Jetzt anfragen

14-822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-262-20-091101

510-87-262-20-091101

CONN SOCKET PGA 262POS GOLD

Preci-Dip

3909 8.60
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510-87-262-20-091101

Datenblatt

Bulk 510 Active PGA 262 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
8080-1G16-LF

8080-1G16-LF

CONN TRANSIST TO-3 3POS SILVER

TE Connectivity AMP Connectors

3963 9.01
- +

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8080-1G16-LF

Datenblatt

Bulk 8080 Active Transistor, TO-3 3 (Oval) - Silver - Beryllium Copper Chassis Mount Closed Frame Solder - Silver - Beryllium Copper Polytetrafluoroethylene (PTFE)
116-93-304-41-001000

116-93-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2089 9.02
- +

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116-93-304-41-001000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-304-41-001000

116-43-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2555 9.02
- +

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116-43-304-41-001000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-6513-10H

28-6513-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2509 9.02
- +

In den Warenkorb

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28-6513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
33-0511-10

33-0511-10

CONN SOCKET SIP 33POS TIN

Aries Electronics

2878 9.02
- +

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33-0511-10

Datenblatt

Bulk 511 Active SIP 33 (1 x 33) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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