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Mfr. Teil #	Lagerbestand	Preis	Menge	Datenblatt	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
14-3508-201 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2980	9.40	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-3508-301 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	3155	9.40	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-192-16-001101 CONN SOCKET PGA 192POS GOLD Preci-Dip	2838	8.90	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	510	Active	PGA	192 (16 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-192-17-081101 CONN SOCKET PGA 192POS GOLD Preci-Dip	2723	8.90	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	510	Active	PGA	192 (17 x 17)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-324-18-000101 CONN SOCKET PGA 324POS GOLD Preci-Dip	3103	8.91	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	510	Active	PGA	324 (18 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-2810-90 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3345	9.44	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	Vertisockets™ 800	Active	DIP, 0.2 (5.08mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
48-6518-11 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	3414	9.44	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	518	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-135-31-018000 CONN SOCKET SIP 35POS GOLD Mill-Max Manufacturing Corp.	3037	9.46	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	714	Active	SIP	35 (1 x 35)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-83-069-11-061112 CONN SOCKET PGA 69POS GOLD Preci-Dip	2944	8.95	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	614	Active	PGA	69 (11 x 11)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-810-90T CONN IC DIP SOCKET 16POS TIN Aries Electronics	3608	9.47	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
510-87-273-21-121101 CONN SOCKET PGA 273POS GOLD Preci-Dip	3208	8.96	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	510	Active	PGA	273 (21 x 21)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICA-640-SGT CONN IC DIP SOCKET 40POS GOLD Samtec Inc.	3217	9.48	- + In den Warenkorb Jetzt anfragen	Datenblatt	Tube	ICA	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyester
346-93-152-41-013000 CONN SOCKET SIP 52POS GOLD Mill-Max Manufacturing Corp.	2458	9.51	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	346	Active	SIP	52 (1 x 52)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-6810-90 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2641	9.51	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	Vertisockets™ 800	Active	DIP, 0.6 (15.24mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6
346-43-152-41-013000 CONN SOCKET SIP 52POS GOLD Mill-Max Manufacturing Corp.	3832	9.51	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	346	Active	SIP	52 (1 x 52)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-3511-11 CONN IC DIP SOCKET 18POS GOLD Aries Electronics	3235	9.51	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	511	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
10-9503-20 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	2682	9.51	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	503	Active	DIP, 0.9 (22.86mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
10-9503-30 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3702	9.51	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	503	Active	DIP, 0.9 (22.86mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-20 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	2467	9.51	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-30 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3226	9.51	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled

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