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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
223-PRS18039-12

223-PRS18039-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3394 121.82
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223-PRS18039-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
225-PLS18003-12

225-PLS18003-12

ZIF PGA SOCKET 225 PIN 18 X 18

Aries Electronics

3068 122.04
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- PLS Active PGA, ZIF (ZIP) 225 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
225-PRS17007-12

225-PRS17007-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3156 122.04
- +

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225-PRS17007-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
225-PRS18003-12

225-PRS18003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2575 122.04
- +

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225-PRS18003-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
289-PLS17001-12

289-PLS17001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3409 122.61
- +

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289-PLS17001-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
210-PRS19034-12

210-PRS19034-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3321 124.36
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210-PRS19034-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
36-6552-18

36-6552-18

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2376 124.89
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-6553-18

36-6553-18

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3917 124.89
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6554-18

36-6554-18

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2455 124.89
- +

In den Warenkorb

Jetzt anfragen

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-3551-18

36-3551-18

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2528 124.89
- +

In den Warenkorb

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Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-3552-18

36-3552-18

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3272 124.89
- +

In den Warenkorb

Jetzt anfragen

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-3553-18

36-3553-18

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2777 124.89
- +

In den Warenkorb

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Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-6551-18

36-6551-18

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2071 124.89
- +

In den Warenkorb

Jetzt anfragen

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-3554-18

36-3554-18

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2021 124.89
- +

In den Warenkorb

Jetzt anfragen

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
264-4205-00

264-4205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

3893 125.63
- +

In den Warenkorb

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Box - Active - - - - - - - - - - - - - -
28-3575-18

28-3575-18

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

3404 128.24
- +

In den Warenkorb

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28-3575-18

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6575-18

28-6575-18

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3338 128.24
- +

In den Warenkorb

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28-6575-18

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
216-PLS21016-12

216-PLS21016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2480 128.76
- +

In den Warenkorb

Jetzt anfragen

216-PLS21016-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
216-PRS21016-12

216-PRS21016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2386 128.76
- +

In den Warenkorb

Jetzt anfragen

216-PRS21016-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
280-PLS19006-12

280-PLS19006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2488 131.69
- +

In den Warenkorb

Jetzt anfragen

280-PLS19006-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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