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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
523-13-132-13-041001

523-13-132-13-041001

PGA SOCKET 13X13 132 PINS

Mill-Max Manufacturing Corp.

3821 0.00
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523-13-132-13-041001

Datenblatt

Bulk 523 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
A06-LCG-T

A06-LCG-T

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components

2785 0.00
- +

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Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold - - Through Hole Open Frame Solder 0.100 (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled
A08-LCG

A08-LCG

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

2461 0.00
- +

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- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A14-LCG

A14-LCG

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

3953 0.00
- +

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A14-LCG

Datenblatt

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A16-LCG

A16-LCG

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

2379 0.00
- +

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- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A18-LCG

A18-LCG

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

2037 0.00
- +

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A18-LCG

Datenblatt

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A20-LCG

A20-LCG

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

3046 0.00
- +

In den Warenkorb

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- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A22-LCG

A22-LCG

CONN IC DIP SOCKET 22POS GOLD

Assmann WSW Components

3122 0.00
- +

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A22-LCG

Datenblatt

- - Obsolete DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A24-LCG

A24-LCG

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

2470 0.00
- +

In den Warenkorb

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- - Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A28-LCG

A28-LCG

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

2986 0.00
- +

In den Warenkorb

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- - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
A40-LCG

A40-LCG

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

3519 0.00
- +

In den Warenkorb

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- - Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - - Through Hole Open Frame - 0.100 (2.54mm) Gold - - -
AR22-HZW/T

AR22-HZW/T

CONN IC DIP SOCKET 22POS GOLD

Assmann WSW Components

2638 0.00
- +

In den Warenkorb

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AR22-HZW/T

Datenblatt

Bag - Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR24-HZW/T

AR24-HZW/T

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

2632 0.00
- +

In den Warenkorb

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AR24-HZW/T

Datenblatt

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR28-HZW/T

AR28-HZW/T

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

3245 0.00
- +

In den Warenkorb

Jetzt anfragen

AR28-HZW/T

Datenblatt

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR40-HZW/T

AR40-HZW/T

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

2330 0.00
- +

In den Warenkorb

Jetzt anfragen

AR40-HZW/T

Datenblatt

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR08-HZL-TT

AR08-HZL-TT

CONN IC DIP SOCKET 8POS TIN

Assmann WSW Components

3915 0.00
- +

In den Warenkorb

Jetzt anfragen

AR08-HZL-TT

Datenblatt

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR14-HZL-TT

AR14-HZL-TT

CONN IC DIP SOCKET 14POS TIN

Assmann WSW Components

2584 0.00
- +

In den Warenkorb

Jetzt anfragen

AR14-HZL-TT

Datenblatt

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR16-HZL-TT

AR16-HZL-TT

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components

3176 0.00
- +

In den Warenkorb

Jetzt anfragen

AR16-HZL-TT

Datenblatt

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR18-HZL-TT

AR18-HZL-TT

CONN IC DIP SOCKET 18POS TIN

Assmann WSW Components

2128 0.00
- +

In den Warenkorb

Jetzt anfragen

AR18-HZL-TT

Datenblatt

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR40-HZL-TT

AR40-HZL-TT

CONN IC DIP SOCKET 40POS TIN

Assmann WSW Components

3111 0.00
- +

In den Warenkorb

Jetzt anfragen

AR40-HZL-TT

Datenblatt

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
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