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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
2-822114-4

2-822114-4

CONN SOCKET PQFP 160POS TIN-LEAD

TE Connectivity AMP Connectors

2030 0.00
- +

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2-822114-4

Datenblatt

Tube - Obsolete QFP 160 (4 x 40) 0.050 (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050 (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP)
A24-LC-7R

A24-LC-7R

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components

2250 0.00
- +

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Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - - Through Hole Open Frame - - - - - -
1-1825093-4

1-1825093-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

3159 0.00
- +

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1-1825093-4

Datenblatt

Tube Diplomate DL Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
5-5916783-2

5-5916783-2

CONN SOCKET PGA ZIF 370POS GOLD

TE Connectivity AMP Connectors

3047 0.00
- +

In den Warenkorb

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Tray - Obsolete PGA, ZIF (ZIP) 370 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Copper Alloy Liquid Crystal Polymer (LCP)
1-1825108-2

1-1825108-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

3756 0.00
- +

In den Warenkorb

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Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
5916716-1

5916716-1

CONN SOCKET PGA ZIF 321POS GOLD

TE Connectivity AMP Connectors

3639 0.00
- +

In den Warenkorb

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5916716-1

Datenblatt

Tray - Obsolete PGA, ZIF (ZIP) 321 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1-390261-2

1-390261-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

2925 0.00
- +

In den Warenkorb

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1-390261-2

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze -
1-390261-3

1-390261-3

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors

3711 0.00
- +

In den Warenkorb

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1-390261-3

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze -
1-390261-4

1-390261-4

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

3778 0.00
- +

In den Warenkorb

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1-390261-4

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze -
1-390262-2

1-390262-2

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

3757 0.00
- +

In den Warenkorb

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1-390262-2

Datenblatt

Tube - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole, Right Angle, Vertical Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze -
2-641266-1

2-641266-1

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

3450 0.00
- +

In den Warenkorb

Jetzt anfragen

2-641266-1

Datenblatt

Box Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic
290-1294-00-3302J

290-1294-00-3302J

CONN IC DIP SOCKET ZIF 90POS GLD

3M

3981 0.00
- +

In den Warenkorb

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290-1294-00-3302J

Datenblatt

Bulk Textool™ Active DIP, ZIF (ZIP) 90 (2 x 45) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
218-7223-55-1902

218-7223-55-1902

CONN SOCKET SOIC 18POS GOLD

3M

3553 0.00
- +

In den Warenkorb

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218-7223-55-1902

Datenblatt

Bulk Textool™ Active SOIC 18 (2 x 9) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
1-390261-8

1-390261-8

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

3822 0.00
- +

In den Warenkorb

Jetzt anfragen

1-390261-8

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze -
390263-5

390263-5

CONN IC DIP SOCKET 42POS TINLEAD

TE Connectivity AMP Connectors

2452 0.00
- +

In den Warenkorb

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390263-5

Datenblatt

Tube - Obsolete DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin-Lead - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Phosphor Bronze -
2-643649-3

2-643649-3

CONN SOCKET SIP 17POS TIN

TE Connectivity AMP Connectors

2795 0.00
- +

In den Warenkorb

Jetzt anfragen

2-643649-3

Datenblatt

Tube Diplomate DL Obsolete SIP 17 (1 x 17) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
1-1437537-9

1-1437537-9

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

2618 0.00
- +

In den Warenkorb

Jetzt anfragen

1-1437537-9

Datenblatt

- 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - -
6-1437539-2

6-1437539-2

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

2707 0.00
- +

In den Warenkorb

Jetzt anfragen

6-1437539-2

Datenblatt

Tube 800 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
2-1437542-7

2-1437542-7

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

3678 0.00
- +

In den Warenkorb

Jetzt anfragen

2-1437542-7

Datenblatt

- 700 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
2-1437531-2

2-1437531-2

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

2269 3.16
- +

In den Warenkorb

Jetzt anfragen

Bulk,Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Copper Alloy -
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