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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
233-PGM18039-51

233-PGM18039-51

CONN SOCKET PGA GOLD

Aries Electronics

2061 0.00
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233-PGM18039-51

Datenblatt

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
256-PG16001-10H

256-PG16001-10H

CONN SOCKET PGA GOLD

Aries Electronics

3753 0.00
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256-PG16001-10H

Datenblatt

Bulk PG Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
257-PGM20012-10

257-PGM20012-10

CONN SOCKET PGA GOLD

Aries Electronics

2581 0.00
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257-PGM20012-10

Datenblatt

Bulk PGM Obsolete PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-14

1109800-14

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3645 0.00
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1109800-14

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-16

1109800-16

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2485 0.00
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1109800-16

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-18

1109800-18

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3490 0.00
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1109800-18

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-20

1109800-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3993 0.00
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1109800-20

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-28

1109800-28

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3496 0.00
- +

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1109800-28

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-10

1109800-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3502 0.00
- +

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1109800-10

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-12

1109800-12

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3023 0.00
- +

In den Warenkorb

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1109800-12

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-22

1109800-22

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2606 0.00
- +

In den Warenkorb

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1109800-22

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-24

1109800-24

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3964 0.00
- +

In den Warenkorb

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1109800-24

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-26

1109800-26

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2002 0.00
- +

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1109800-26

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109800-8

1109800-8

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2116 0.00
- +

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1109800-8

Datenblatt

Bulk Correct-A-Chip® 1109800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-308

1109681-308

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2577 0.00
- +

In den Warenkorb

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1109681-308

Datenblatt

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-314

1109681-314

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2534 0.00
- +

In den Warenkorb

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1109681-314

Datenblatt

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-316

1109681-316

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2938 0.00
- +

In den Warenkorb

Jetzt anfragen

1109681-316

Datenblatt

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-318

1109681-318

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3089 0.00
- +

In den Warenkorb

Jetzt anfragen

1109681-318

Datenblatt

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-320

1109681-320

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2632 0.00
- +

In den Warenkorb

Jetzt anfragen

1109681-320

Datenblatt

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-324

1109681-324

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3893 0.00
- +

In den Warenkorb

Jetzt anfragen

1109681-324

Datenblatt

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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