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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
540-88-084-24-008

540-88-084-24-008

CONN SOCKET PLCC 84POS TIN

Preci-Dip

3397 1.93
- +

In den Warenkorb

Jetzt anfragen

540-88-084-24-008

Datenblatt

Bulk 540 Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-83-322-41-012101

116-83-322-41-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2298 1.93
- +

In den Warenkorb

Jetzt anfragen

116-83-322-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-632-41-001101

115-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3302 1.93
- +

In den Warenkorb

Jetzt anfragen

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-007101

116-83-320-41-007101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3612 1.94
- +

In den Warenkorb

Jetzt anfragen

116-83-320-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-007101

116-83-420-41-007101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2158 2.07
- +

In den Warenkorb

Jetzt anfragen

116-83-420-41-007101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-624-31-012101

614-83-624-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3951 1.94
- +

In den Warenkorb

Jetzt anfragen

614-83-624-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-1518-10H

14-1518-10H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3282 2.07
- +

In den Warenkorb

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14-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0508-20

04-0508-20

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2556 2.07
- +

In den Warenkorb

Jetzt anfragen

04-0508-20

Datenblatt

Bulk 508 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
04-0508-30

04-0508-30

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2933 2.07
- +

In den Warenkorb

Jetzt anfragen

04-0508-30

Datenblatt

Bulk 508 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
04-1508-20

04-1508-20

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2998 2.07
- +

In den Warenkorb

Jetzt anfragen

04-1508-20

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
04-1508-30

04-1508-30

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2189 2.07
- +

In den Warenkorb

Jetzt anfragen

04-1508-30

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
24-6518-10T

24-6518-10T

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3954 2.07
- +

In den Warenkorb

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24-6518-10T

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-318-41-009101

116-83-318-41-009101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3200 1.95
- +

In den Warenkorb

Jetzt anfragen

116-83-318-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
BU220Z-178-HT

BU220Z-178-HT

CONN IC DIP SOCKET 22POS GOLD

On Shore Technology Inc.

2140 2.07
- +

In den Warenkorb

Jetzt anfragen

BU220Z-178-HT

Datenblatt

Tube BU-178HT Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled
08-3513-11

08-3513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3099 2.08
- +

In den Warenkorb

Jetzt anfragen

08-3513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3518-10M

08-3518-10M

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3076 2.08
- +

In den Warenkorb

Jetzt anfragen

08-3518-10M

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
PX-84LCC

PX-84LCC

LEADLESS CHIP CARRIER 84P PBT RO

Kycon, Inc.

2080 2.08
- +

In den Warenkorb

Jetzt anfragen

Tube PX Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-87-432-41-018101

116-87-432-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3176 2.14
- +

In den Warenkorb

Jetzt anfragen

116-87-432-41-018101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-018101

116-87-632-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3637 2.14
- +

In den Warenkorb

Jetzt anfragen

116-87-632-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-652-41-005101

110-87-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2658 1.96
- +

In den Warenkorb

Jetzt anfragen

110-87-652-41-005101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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