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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
08-3511-10

08-3511-10

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2093 2.14
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08-3511-10

Datenblatt

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-10T

17-0518-10T

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2453 2.14
- +

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17-0518-10T

Datenblatt

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0517-90C

05-0517-90C

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3985 2.14
- +

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05-0517-90C

Datenblatt

Bulk 0517 Active SIP 5 (1 x 5) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-110-41-013000

346-93-110-41-013000

CONN SOCKET SIP 10POS GOLD

Mill-Max Manufacturing Corp.

3148 2.15
- +

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346-93-110-41-013000

Datenblatt

Tube 346 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-110-41-013000

346-43-110-41-013000

CONN SOCKET SIP 10POS GOLD

Mill-Max Manufacturing Corp.

2566 2.15
- +

In den Warenkorb

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346-43-110-41-013000

Datenblatt

Bulk 346 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-320-41-002101

116-83-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2876 2.02
- +

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116-83-320-41-002101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-006101

116-87-432-41-006101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2682 2.02
- +

In den Warenkorb

Jetzt anfragen

116-87-432-41-006101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-316-41-002101

124-83-316-41-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2784 2.02
- +

In den Warenkorb

Jetzt anfragen

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-432-41-105101

117-87-432-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3871 2.02
- +

In den Warenkorb

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117-87-432-41-105101

Datenblatt

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-328-41-001101

612-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3004 2.02
- +

In den Warenkorb

Jetzt anfragen

612-83-328-41-001101

Datenblatt

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-004101

116-83-314-41-004101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3406 2.17
- +

In den Warenkorb

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116-83-314-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-004101

116-87-316-41-004101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2020 2.03
- +

In den Warenkorb

Jetzt anfragen

116-87-316-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-628-41-001101

612-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3880 2.37
- +

In den Warenkorb

Jetzt anfragen

612-83-628-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-009101

116-87-324-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3341 2.18
- +

In den Warenkorb

Jetzt anfragen

116-87-324-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-6513-11

06-6513-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3065 2.18
- +

In den Warenkorb

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06-6513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2513-11

08-2513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3300 2.18
- +

In den Warenkorb

Jetzt anfragen

08-2513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0513-10H

09-0513-10H

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3307 2.18
- +

In den Warenkorb

Jetzt anfragen

09-0513-10H

Datenblatt

Bulk 0513 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0518-10H

15-0518-10H

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2635 2.18
- +

In den Warenkorb

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15-0518-10H

Datenblatt

Bulk 518 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0518-10T

16-0518-10T

CONN SOCKET SIP 16POS GOLD

Aries Electronics

3252 2.18
- +

In den Warenkorb

Jetzt anfragen

16-0518-10T

Datenblatt

Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-1518-10

18-1518-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2358 2.18
- +

In den Warenkorb

Jetzt anfragen

18-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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