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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-83-636-41-117101

114-83-636-41-117101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3454 2.47
- +

In den Warenkorb

Jetzt anfragen

114-83-636-41-117101

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-432-41-001101

614-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2166 2.25
- +

In den Warenkorb

Jetzt anfragen

614-83-432-41-001101

Datenblatt

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-428-31-012101

614-83-428-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2465 2.26
- +

In den Warenkorb

Jetzt anfragen

614-83-428-31-012101

Datenblatt

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-628-31-012101

614-83-628-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3829 2.42
- +

In den Warenkorb

Jetzt anfragen

614-83-628-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-075-11-001101

510-87-075-11-001101

CONN SOCKET PGA 75POS GOLD

Preci-Dip

3750 2.26
- +

In den Warenkorb

Jetzt anfragen

510-87-075-11-001101

Datenblatt

Bulk 510 Active PGA 75 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-648-41-117101

114-87-648-41-117101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3261 2.26
- +

In den Warenkorb

Jetzt anfragen

114-87-648-41-117101

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-008101

116-87-624-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3056 2.26
- +

In den Warenkorb

Jetzt anfragen

116-87-624-41-008101

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-008101

116-87-424-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3495 2.26
- +

In den Warenkorb

Jetzt anfragen

116-87-424-41-008101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-314-10-001101

299-87-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2308 2.26
- +

In den Warenkorb

Jetzt anfragen

299-87-314-10-001101

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-012101

116-87-428-41-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3057 2.26
- +

In den Warenkorb

Jetzt anfragen

116-87-428-41-012101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-052-09-041101

510-83-052-09-041101

CONN SOCKET PGA 52POS GOLD

Preci-Dip

2361 2.26
- +

In den Warenkorb

Jetzt anfragen

510-83-052-09-041101

Datenblatt

Bulk 510 Active PGA 52 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-640-41-005101

117-83-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2633 2.43
- +

In den Warenkorb

Jetzt anfragen

117-83-640-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
21-0518-10

21-0518-10

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2083 2.42
- +

In den Warenkorb

Jetzt anfragen

21-0518-10

Datenblatt

Bulk 518 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-87-324-41-105191

110-87-324-41-105191

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2517 2.33
- +

In den Warenkorb

Jetzt anfragen

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-318-41-002101

124-83-318-41-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2333 2.27
- +

In den Warenkorb

Jetzt anfragen

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-006101

116-87-636-41-006101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2116 2.27
- +

In den Warenkorb

Jetzt anfragen

116-87-636-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-003101

116-87-432-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3580 2.27
- +

In den Warenkorb

Jetzt anfragen

116-87-432-41-003101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-003101

116-87-632-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3554 2.27
- +

In den Warenkorb

Jetzt anfragen

116-87-632-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-008101

116-83-322-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3030 2.43
- +

In den Warenkorb

Jetzt anfragen

116-83-322-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-007101

116-83-322-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2486 2.28
- +

In den Warenkorb

Jetzt anfragen

116-83-322-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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