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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
ICF-318-T-I-TR

ICF-318-T-I-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2094 2.33
- +

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Tape & Reel (TR) iCF Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
28-6518-10T

28-6518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3352 2.33
- +

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28-6518-10T

Datenblatt

Tube 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
121-83-324-41-001101

121-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2480 2.26
- +

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121-83-324-41-001101

Datenblatt

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-650-41-001101

115-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2345 2.18
- +

In den Warenkorb

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Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-018101

116-83-328-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2282 2.19
- +

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116-83-328-41-018101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-610-10-002101

299-87-610-10-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2375 2.19
- +

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299-87-610-10-002101

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-328-31-012101

614-83-328-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3032 2.18
- +

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614-83-328-31-012101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-6513-10

12-6513-10

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2033 2.35
- +

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12-6513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0513-11

09-0513-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3069 2.35
- +

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09-0513-11

Datenblatt

Bulk 0513 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0513-10T

16-0513-10T

CONN SOCKET SIP 16POS GOLD

Aries Electronics

3247 2.35
- +

In den Warenkorb

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16-0513-10T

Datenblatt

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0518-11

14-0518-11

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3026 2.35
- +

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14-0518-11

Datenblatt

Bulk 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-1518-11

14-1518-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3391 2.35
- +

In den Warenkorb

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14-1518-11

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
146-83-322-41-035101

146-83-322-41-035101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3876 2.20
- +

In den Warenkorb

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146-83-322-41-035101

Datenblatt

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-322-41-036101

146-83-322-41-036101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3206 2.20
- +

In den Warenkorb

Jetzt anfragen

146-83-322-41-036101

Datenblatt

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-422-41-035101

146-83-422-41-035101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2401 2.20
- +

In den Warenkorb

Jetzt anfragen

146-83-422-41-035101

Datenblatt

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-422-41-036101

146-83-422-41-036101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2387 2.20
- +

In den Warenkorb

Jetzt anfragen

146-83-422-41-036101

Datenblatt

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-001101

116-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2734 2.20
- +

In den Warenkorb

Jetzt anfragen

116-87-322-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-001101

116-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2506 2.20
- +

In den Warenkorb

Jetzt anfragen

116-87-422-41-001101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-111-41-013000

346-93-111-41-013000

CONN SOCKET SIP 11POS GOLD

Mill-Max Manufacturing Corp.

2331 2.36
- +

In den Warenkorb

Jetzt anfragen

346-93-111-41-013000

Datenblatt

Bulk 346 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-111-41-013000

346-43-111-41-013000

CONN SOCKET SIP 11POS GOLD

Mill-Max Manufacturing Corp.

2136 2.36
- +

In den Warenkorb

Jetzt anfragen

346-43-111-41-013000

Datenblatt

Bulk 346 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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