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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-3511-10WR

16-3511-10WR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2107 2.74
- +

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16-3511-10WR

Datenblatt

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-632-41-105161

110-83-632-41-105161

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3710 2.58
- +

In den Warenkorb

Jetzt anfragen

110-83-632-41-105161

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-316-10-001101

299-87-316-10-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2228 2.59
- +

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299-87-316-10-001101

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-001101

116-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2010 2.77
- +

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116-83-422-41-001101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-640-41-003101

115-83-640-41-003101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3365 2.84
- +

In den Warenkorb

Jetzt anfragen

115-83-640-41-003101

Datenblatt

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-314-SST

ICO-314-SST

CONN IC DIP SOCKET 14POS GOLD

Samtec Inc.

2796 2.69
- +

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ICO-314-SST

Datenblatt

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
08-3513-10H

08-3513-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3883 2.76
- +

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08-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-640-41-005101

110-83-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3028 2.60
- +

In den Warenkorb

Jetzt anfragen

110-83-640-41-005101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-640-41-605101

110-83-640-41-605101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3491 2.60
- +

In den Warenkorb

Jetzt anfragen

110-83-640-41-605101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
808-AG11D

808-AG11D

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

3258 2.76
- +

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808-AG11D

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
115-87-952-41-001101

115-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2370 2.60
- +

In den Warenkorb

Jetzt anfragen

Bulk 115 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-93-314-31-012000

614-93-314-31-012000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3378 2.77
- +

In den Warenkorb

Jetzt anfragen

614-93-314-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-87-328-41-105191

110-87-328-41-105191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3782 2.66
- +

In den Warenkorb

Jetzt anfragen

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3513-10T

20-3513-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2774 2.78
- +

In den Warenkorb

Jetzt anfragen

20-3513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-114-41-013000

346-93-114-41-013000

CONN SOCKET SIP 14POS GOLD

Mill-Max Manufacturing Corp.

2526 2.78
- +

In den Warenkorb

Jetzt anfragen

346-93-114-41-013000

Datenblatt

Bulk 346 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-114-41-013000

346-43-114-41-013000

CONN SOCKET SIP 14POS GOLD

Mill-Max Manufacturing Corp.

2305 2.78
- +

In den Warenkorb

Jetzt anfragen

346-43-114-41-013000

Datenblatt

Bulk 346 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-83-314-11-001101

299-83-314-11-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3949 2.62
- +

In den Warenkorb

Jetzt anfragen

299-83-314-11-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-432-41-035101

146-87-432-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2829 2.62
- +

In den Warenkorb

Jetzt anfragen

146-87-432-41-035101

Datenblatt

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-432-41-036101

146-87-432-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2300 2.62
- +

In den Warenkorb

Jetzt anfragen

146-87-432-41-036101

Datenblatt

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-612-10-002101

299-87-612-10-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3010 2.63
- +

In den Warenkorb

Jetzt anfragen

299-87-612-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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