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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-3518-11

20-3518-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2599 3.91
- +

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20-3518-11

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-636-41-009101

116-87-636-41-009101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3586 3.68
- +

In den Warenkorb

Jetzt anfragen

116-87-636-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-003101

116-87-652-41-003101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2132 3.80
- +

In den Warenkorb

Jetzt anfragen

116-87-652-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-316-T-A1

APA-316-T-A1

ADAPTER PLUG

Samtec Inc.

3901 3.94
- +

In den Warenkorb

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Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
14-3513-10H

14-3513-10H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3112 3.95
- +

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14-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-073-11-061101

510-83-073-11-061101

CONN SOCKET PGA 73POS GOLD

Preci-Dip

3854 3.71
- +

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510-83-073-11-061101

Datenblatt

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-642-41-105161

110-83-642-41-105161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3933 3.72
- +

In den Warenkorb

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110-83-642-41-105161

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
15-0513-11H

15-0513-11H

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2106 3.96
- +

In den Warenkorb

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15-0513-11H

Datenblatt

Bulk 0513 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0513-11

18-0513-11

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2730 3.96
- +

In den Warenkorb

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18-0513-11

Datenblatt

Bulk 0513 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0518-11

23-0518-11

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3334 3.96
- +

In den Warenkorb

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23-0518-11

Datenblatt

Bulk 518 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
31-0518-10T

31-0518-10T

CONN SOCKET SIP 31POS GOLD

Aries Electronics

2479 3.96
- +

In den Warenkorb

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31-0518-10T

Datenblatt

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0518-10

34-0518-10

CONN SOCKET SIP 34POS GOLD

Aries Electronics

2392 3.96
- +

In den Warenkorb

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34-0518-10

Datenblatt

Bulk 518 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-318-41-013101

116-87-318-41-013101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2525 3.73
- +

In den Warenkorb

Jetzt anfragen

116-87-318-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-318-SGT

ICO-318-SGT

CONN IC DIP SOCKET 18POS GOLD

Samtec Inc.

3448 3.97
- +

In den Warenkorb

Jetzt anfragen

ICO-318-SGT

Datenblatt

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
299-83-320-11-001101

299-83-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3665 3.74
- +

In den Warenkorb

Jetzt anfragen

299-83-320-11-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-124-13-041101

510-87-124-13-041101

CONN SOCKET PGA 124POS GOLD

Preci-Dip

3981 3.74
- +

In den Warenkorb

Jetzt anfragen

510-87-124-13-041101

Datenblatt

Bulk 510 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-004101

116-83-322-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2912 3.74
- +

In den Warenkorb

Jetzt anfragen

116-83-322-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-004101

116-83-422-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2616 3.74
- +

In den Warenkorb

Jetzt anfragen

116-83-422-41-004101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-616-10-002101

299-87-616-10-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2343 4.11
- +

In den Warenkorb

Jetzt anfragen

299-87-616-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
22-3513-10

22-3513-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3867 3.98
- +

In den Warenkorb

Jetzt anfragen

22-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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