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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
346-43-119-41-013000

346-43-119-41-013000

CONN SOCKET SIP 19POS GOLD

Mill-Max Manufacturing Corp.

2941 3.78
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346-43-119-41-013000

Datenblatt

Bulk 346 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-83-632-41-035101

146-83-632-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3105 3.54
- +

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146-83-632-41-035101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-632-41-036101

146-83-632-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2700 3.54
- +

In den Warenkorb

Jetzt anfragen

146-83-632-41-036101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-003101

116-87-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2184 3.65
- +

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116-87-650-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-424-41-002101

124-83-424-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2822 3.55
- +

In den Warenkorb

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Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-624-41-002101

124-83-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3556 3.55
- +

In den Warenkorb

Jetzt anfragen

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-650-41-003101

115-83-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3314 3.55
- +

In den Warenkorb

Jetzt anfragen

115-83-650-41-003101

Datenblatt

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-009101

116-83-428-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3904 3.55
- +

In den Warenkorb

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116-83-428-41-009101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-009101

116-83-628-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3577 3.66
- +

In den Warenkorb

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116-83-628-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-642-41-001101

612-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2172 3.56
- +

In den Warenkorb

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612-83-642-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-0513-11H

12-0513-11H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2132 3.80
- +

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12-0513-11H

Datenblatt

Bulk 0513 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-11H

13-0518-11H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2140 3.80
- +

In den Warenkorb

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13-0518-11H

Datenblatt

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-1518-10T

30-1518-10T

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2308 3.80
- +

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30-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-10T

24-3513-10T

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3117 3.80
- +

In den Warenkorb

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24-3513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-636-41-007101

116-87-636-41-007101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2660 3.59
- +

In den Warenkorb

Jetzt anfragen

116-87-636-41-007101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-113-31-018000

714-43-113-31-018000

CONN SOCKET SIP 13POS GOLD

Mill-Max Manufacturing Corp.

3951 3.82
- +

In den Warenkorb

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714-43-113-31-018000

Datenblatt

Bulk 714 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
06-2503-20

06-2503-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3776 3.82
- +

In den Warenkorb

Jetzt anfragen

06-2503-20

Datenblatt

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-2503-30

06-2503-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3026 3.82
- +

In den Warenkorb

Jetzt anfragen

06-2503-30

Datenblatt

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
612-87-652-41-001101

612-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3801 3.61
- +

In den Warenkorb

Jetzt anfragen

612-87-652-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-120-13-001101

510-87-120-13-001101

CONN SOCKET PGA 120POS GOLD

Preci-Dip

3929 3.62
- +

In den Warenkorb

Jetzt anfragen

510-87-120-13-001101

Datenblatt

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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