Foto | Mfr. Teil # | Lagerbestand | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
28-0518-11CONN SOCKET SIP 28POS GOLD |
3712 | 5.19 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 518 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
28-1518-11CONN IC DIP SOCKET 28POS GOLD |
3276 | 5.19 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
10-0508-20CONN SOCKET SIP 10POS GOLD |
3242 | 5.19 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 508 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | |
10-0508-30CONN SOCKET SIP 10POS GOLD |
2381 | 5.19 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 508 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | |
10-1508-20CONN IC DIP SOCKET 10POS GOLD |
2178 | 5.19 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | |
10-1508-30CONN IC DIP SOCKET 10POS GOLD |
3750 | 5.19 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | |
11-0517-90CCONN SOCKET SIP 11POS GOLD |
2213 | 5.19 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 0517 | Active | SIP | 11 (1 x 11) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
XR2A-2801-NCONN IC DIP SOCKET 28POS GOLD |
3817 | 5.19 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | |
08-6501-20CONN IC DIP SOCKET 8POS TIN |
2444 | 5.20 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
08-6501-30CONN IC DIP SOCKET 8POS TIN |
2769 | 5.20 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
20-6511-10CONN IC DIP SOCKET 20POS TIN |
2515 | 5.20 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 511 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
16-3513-11HCONN IC DIP SOCKET 16POS GOLD |
2268 | 5.23 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
08-2503-20CONN IC DIP SOCKET 8POS GOLD |
3793 | 5.24 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 503 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
21-0513-10HCONN SOCKET SIP 21POS GOLD |
2160 | 5.24 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 0513 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
38-0518-10TCONN SOCKET SIP 38POS GOLD |
3422 | 5.24 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 518 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
122-87-648-41-001101CONN IC DIP SOCKET 48POS GOLD |
2630 | 4.95 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 122 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
123-87-648-41-001101CONN IC DIP SOCKET 48POS GOLD |
2883 | 4.95 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
510-87-175-14-001101CONN SOCKET PGA 175POS GOLD |
2527 | 5.28 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 510 | Active | PGA | 175 (14 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
116-83-642-41-002101CONN IC DIP SOCKET 42POS GOLD |
3985 | 4.97 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
116-83-636-41-001101CONN IC DIP SOCKET 36POS GOLD |
2346 | 4.97 |
In den WarenkorbJetzt anfragen |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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