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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-0518-11

28-0518-11

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3712 5.19
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28-0518-11

Datenblatt

Bulk 518 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-11

28-1518-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3276 5.19
- +

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28-1518-11

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0508-20

10-0508-20

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3242 5.19
- +

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10-0508-20

Datenblatt

Bulk 508 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
10-0508-30

10-0508-30

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2381 5.19
- +

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10-0508-30

Datenblatt

Bulk 508 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
10-1508-20

10-1508-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2178 5.19
- +

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10-1508-20

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
10-1508-30

10-1508-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3750 5.19
- +

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10-1508-30

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
11-0517-90C

11-0517-90C

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2213 5.19
- +

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11-0517-90C

Datenblatt

Bulk 0517 Active SIP 11 (1 x 11) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
XR2A-2801-N

XR2A-2801-N

CONN IC DIP SOCKET 28POS GOLD

Omron Electronics Inc-EMC Div

3817 5.19
- +

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XR2A-2801-N

Datenblatt

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
08-6501-20

08-6501-20

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2444 5.20
- +

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08-6501-20

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-6501-30

08-6501-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2769 5.20
- +

In den Warenkorb

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08-6501-30

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-6511-10

20-6511-10

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2515 5.20
- +

In den Warenkorb

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20-6511-10

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3513-11H

16-3513-11H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2268 5.23
- +

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16-3513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2503-20

08-2503-20

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3793 5.24
- +

In den Warenkorb

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08-2503-20

Datenblatt

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-0513-10H

21-0513-10H

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2160 5.24
- +

In den Warenkorb

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21-0513-10H

Datenblatt

Bulk 0513 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-0518-10T

38-0518-10T

CONN SOCKET SIP 38POS GOLD

Aries Electronics

3422 5.24
- +

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38-0518-10T

Datenblatt

Bulk 518 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-87-648-41-001101

122-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2630 4.95
- +

In den Warenkorb

Jetzt anfragen

122-87-648-41-001101

Datenblatt

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-648-41-001101

123-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2883 4.95
- +

In den Warenkorb

Jetzt anfragen

123-87-648-41-001101

Datenblatt

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-14-001101

510-87-175-14-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

2527 5.28
- +

In den Warenkorb

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510-87-175-14-001101

Datenblatt

Bulk 510 Active PGA 175 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-002101

116-83-642-41-002101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3985 4.97
- +

In den Warenkorb

Jetzt anfragen

116-83-642-41-002101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-001101

116-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2346 4.97
- +

In den Warenkorb

Jetzt anfragen

116-83-636-41-001101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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