Willkommen in Element tech company!

+86 15361839241 +86 0755-23603516
Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-324-41-013101

116-87-324-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3772 4.98
- +

In den Warenkorb

Jetzt anfragen

116-87-324-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-013101

116-87-424-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3824 4.98
- +

In den Warenkorb

Jetzt anfragen

116-87-424-41-013101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-013101

116-87-624-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3802 4.98
- +

In den Warenkorb

Jetzt anfragen

116-87-624-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-316-T-N

APA-316-T-N

ADAPTER PLUG

Samtec Inc.

3539 5.28
- +

In den Warenkorb

Jetzt anfragen

Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
10-2501-20

10-2501-20

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

2289 5.28
- +

In den Warenkorb

Jetzt anfragen

10-2501-20

Datenblatt

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-2501-30

10-2501-30

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

2827 5.28
- +

In den Warenkorb

Jetzt anfragen

10-2501-30

Datenblatt

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6513-11H

10-6513-11H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3270 5.28
- +

In den Warenkorb

Jetzt anfragen

10-6513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-1518-00

20-1518-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3869 5.28
- +

In den Warenkorb

Jetzt anfragen

20-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
35-0518-10H

35-0518-10H

CONN SOCKET SIP 35POS GOLD

Aries Electronics

3535 5.28
- +

In den Warenkorb

Jetzt anfragen

35-0518-10H

Datenblatt

Bulk 518 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-0518-10H

40-0518-10H

CONN SOCKET SIP 40POS GOLD

Aries Electronics

2066 5.28
- +

In den Warenkorb

Jetzt anfragen

40-0518-10H

Datenblatt

Bulk 518 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3513-11H

14-3513-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3726 5.29
- +

In den Warenkorb

Jetzt anfragen

14-3513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-118-31-018000

714-43-118-31-018000

CONN SOCKET SIP 18POS GOLD

Mill-Max Manufacturing Corp.

2433 5.29
- +

In den Warenkorb

Jetzt anfragen

714-43-118-31-018000

Datenblatt

Bulk 714 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-624-41-801000

110-43-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2985 5.31
- +

In den Warenkorb

Jetzt anfragen

110-43-624-41-801000

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6513-10T

32-6513-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3626 5.33
- +

In den Warenkorb

Jetzt anfragen

32-6513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-308-G-M

APA-308-G-M

ADAPTER PLUG

Samtec Inc.

3174 5.33
- +

In den Warenkorb

Jetzt anfragen

Tube APA Active - 8 (2 x 4) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
299-83-618-10-002101

299-83-618-10-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2994 5.05
- +

In den Warenkorb

Jetzt anfragen

299-83-618-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-013101

116-83-322-41-013101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3449 5.37
- +

In den Warenkorb

Jetzt anfragen

116-83-322-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-013101

116-83-422-41-013101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2263 5.37
- +

In den Warenkorb

Jetzt anfragen

116-83-422-41-013101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6518-00

32-6518-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2967 5.36
- +

In den Warenkorb

Jetzt anfragen

32-6518-00

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-11H

17-0518-11H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2048 5.36
- +

In den Warenkorb

Jetzt anfragen

17-0518-11H

Datenblatt

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Records«Prev1... 195196197198199200201202...1100Next»
Fordern Sie ein Angebot an
Teilenummer
Menge
Kontakt
E-Mail
Bemerkungen
  • HOME

    HOME

    PRODUCT

    PRODUKT

    PHONE

    TELEFON

    USER

    BENUTZER