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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-0508-31

06-0508-31

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3306 5.94
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06-0508-31

Datenblatt

Bulk 508 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
06-1508-21

06-1508-21

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3501 5.94
- +

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06-1508-21

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
06-1508-31

06-1508-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3585 5.94
- +

In den Warenkorb

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06-1508-31

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
32-3513-10T

32-3513-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3423 5.94
- +

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32-3513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-121-13-001101

510-83-121-13-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

2359 5.61
- +

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510-83-121-13-001101

Datenblatt

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-121-13-041101

510-83-121-13-041101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

3529 5.61
- +

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510-83-121-13-041101

Datenblatt

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-121-13-061101

510-83-121-13-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

2564 5.61
- +

In den Warenkorb

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510-83-121-13-061101

Datenblatt

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
05-0511-10

05-0511-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

2236 5.95
- +

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05-0511-10

Datenblatt

Bulk 511 Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6513-10T

48-6513-10T

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3486 5.95
- +

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48-6513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-87-624-10-002101

299-87-624-10-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2724 5.62
- +

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299-87-624-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-008101

116-87-648-41-008101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3159 5.62
- +

In den Warenkorb

Jetzt anfragen

116-87-648-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-121-11-000101

510-83-121-11-000101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

3625 5.61
- +

In den Warenkorb

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510-83-121-11-000101

Datenblatt

Bulk 510 Active PGA 121 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-007101

116-87-652-41-007101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2648 5.63
- +

In den Warenkorb

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116-87-652-41-007101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
21-0513-11

21-0513-11

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2365 5.96
- +

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21-0513-11

Datenblatt

Bulk 0513 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-10H

24-0513-10H

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3882 5.96
- +

In den Warenkorb

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24-0513-10H

Datenblatt

Bulk 0513 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0518-11H

19-0518-11H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2316 5.96
- +

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19-0518-11H

Datenblatt

Bulk 518 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-1518-10H

40-1518-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3933 5.96
- +

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40-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
44-1518-10T

44-1518-10T

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

2716 5.96
- +

In den Warenkorb

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44-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-130-41-013000

346-93-130-41-013000

CONN SOCKET SIP 30POS GOLD

Mill-Max Manufacturing Corp.

3783 5.97
- +

In den Warenkorb

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346-93-130-41-013000

Datenblatt

Bulk 346 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-130-41-013000

346-43-130-41-013000

CONN SOCKET SIP 30POS GOLD

Mill-Max Manufacturing Corp.

2765 5.97
- +

In den Warenkorb

Jetzt anfragen

346-43-130-41-013000

Datenblatt

Bulk 346 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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