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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
12-8450-310C

12-8450-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3256 9.78
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12-8450-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8510-310C

12-8510-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3965 9.78
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12-8510-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8590-310C

12-8590-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2055 9.78
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12-8590-310C

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0517-90C

23-0517-90C

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2381 9.78
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23-0517-90C

Datenblatt

Bulk 0517 Active SIP 23 (1 x 23) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
39-0511-10

39-0511-10

CONN SOCKET SIP 39POS TIN

Aries Electronics

3742 9.80
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39-0511-10

Datenblatt

Bulk 511 Active SIP 39 (1 x 39) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-820-90TWR

16-820-90TWR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3565 9.80
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16-820-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-822-90TWR

16-822-90TWR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2599 9.80
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16-822-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-823-90TWR

16-823-90TWR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2300 9.80
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16-823-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-6503-20

18-6503-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3702 9.82
- +

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18-6503-20

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-6503-30

18-6503-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3609 9.82
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18-6503-30

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
614-87-088-13-062112

614-87-088-13-062112

CONN SOCKET PGA 88POS GOLD

Preci-Dip

2940 9.32
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614-87-088-13-062112

Datenblatt

Bulk 614 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-088-13-081112

614-87-088-13-081112

CONN SOCKET PGA 88POS GOLD

Preci-Dip

3872 9.32
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614-87-088-13-081112

Datenblatt

Bulk 614 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-309-21-001101

510-87-309-21-001101

CONN SOCKET PGA 309POS GOLD

Preci-Dip

2542 9.32
- +

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510-87-309-21-001101

Datenblatt

Bulk 510 Active PGA 309 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-201-15-041101

510-83-201-15-041101

CONN SOCKET PGA 201POS GOLD

Preci-Dip

3093 9.32
- +

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510-83-201-15-041101

Datenblatt

Bulk 510 Active PGA 201 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
40-0518-00

40-0518-00

CONN SOCKET SIP 40POS GOLD

Aries Electronics

3839 9.84
- +

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40-0518-00

Datenblatt

Bulk 518 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-1518-00

40-1518-00

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3915 9.84
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40-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
35-0518-11H

35-0518-11H

CONN SOCKET SIP 35POS GOLD

Aries Electronics

2059 9.84
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35-0518-11H

Datenblatt

Bulk 518 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-0518-11H

40-0518-11H

CONN SOCKET SIP 40POS GOLD

Aries Electronics

2549 9.84
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In den Warenkorb

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40-0518-11H

Datenblatt

Bulk 518 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-314-G-N

APA-314-G-N

ADAPTER PLUG

Samtec Inc.

2568 9.84
- +

In den Warenkorb

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Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
346-93-154-41-013000

346-93-154-41-013000

CONN SOCKET SIP 54POS GOLD

Mill-Max Manufacturing Corp.

3191 9.88
- +

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346-93-154-41-013000

Datenblatt

Bulk 346 Active SIP 54 (1 x 54) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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