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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-7600-10

10-7600-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

3694 10.18
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10-7600-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7775-10

10-7775-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

3555 10.18
- +

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10-7775-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7860-10

10-7860-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2692 10.18
- +

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10-7860-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-7925-10

10-7925-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

2798 10.18
- +

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10-7925-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-3513-10H

40-3513-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3914 10.18
- +

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40-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6810-90C

10-6810-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3174 10.18
- +

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10-6810-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-10H

28-3513-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2128 10.20
- +

In den Warenkorb

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28-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-209-17-001101

510-83-209-17-001101

CONN SOCKET PGA 209POS GOLD

Preci-Dip

3120 9.69
- +

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510-83-209-17-001101

Datenblatt

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-209-17-062101

510-83-209-17-062101

CONN SOCKET PGA 209POS GOLD

Preci-Dip

3213 9.69
- +

In den Warenkorb

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510-83-209-17-062101

Datenblatt

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-209-17-063101

510-83-209-17-063101

CONN SOCKET PGA 209POS GOLD

Preci-Dip

2706 9.69
- +

In den Warenkorb

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510-83-209-17-063101

Datenblatt

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-209-17-081101

510-83-209-17-081101

CONN SOCKET PGA 209POS GOLD

Preci-Dip

3892 9.69
- +

In den Warenkorb

Jetzt anfragen

510-83-209-17-081101

Datenblatt

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3501-21

20-3501-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3339 10.20
- +

In den Warenkorb

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20-3501-21

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-3501-31

20-3501-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3022 10.20
- +

In den Warenkorb

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20-3501-31

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-6501-20

36-6501-20

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

3094 10.20
- +

In den Warenkorb

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36-6501-20

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-6501-30

36-6501-30

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

2404 10.20
- +

In den Warenkorb

Jetzt anfragen

36-6501-30

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-1518-11H

40-1518-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2735 10.20
- +

In den Warenkorb

Jetzt anfragen

40-1518-11H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6501-21

14-6501-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2466 10.20
- +

In den Warenkorb

Jetzt anfragen

14-6501-21

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-6501-31

14-6501-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2123 10.20
- +

In den Warenkorb

Jetzt anfragen

14-6501-31

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
APA-318-G-A

APA-318-G-A

ADAPTER PLUG

Samtec Inc.

3218 10.22
- +

In den Warenkorb

Jetzt anfragen

Bulk APA Active - 18 (2 x 9) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
18-3518-01

18-3518-01

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3721 10.22
- +

In den Warenkorb

Jetzt anfragen

18-3518-01

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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