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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-3508-202

16-3508-202

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3385 10.28
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16-3508-202

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-302

16-3508-302

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3099 10.28
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16-3508-302

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6820-90T

20-6820-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3342 10.28
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20-6820-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-820-90T

20-820-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3411 10.28
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20-820-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
20-822-90T

20-822-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3031 10.28
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20-822-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
14-81000-610C

14-81000-610C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2920 10.28
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14-81000-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81150-610C

14-81150-610C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3507 10.28
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14-81150-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81250-610C

14-81250-610C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2775 10.28
- +

In den Warenkorb

Jetzt anfragen

14-81250-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8350-610C

14-8350-610C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3353 10.28
- +

In den Warenkorb

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14-8350-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8385-610C

14-8385-610C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2441 10.28
- +

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14-8385-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8510-610C

14-8510-610C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2147 10.28
- +

In den Warenkorb

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14-8510-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8625-610C

14-8625-610C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3411 10.28
- +

In den Warenkorb

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14-8625-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8900-610C

14-8900-610C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2614 10.28
- +

In den Warenkorb

Jetzt anfragen

14-8900-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0501-21

09-0501-21

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2836 10.29
- +

In den Warenkorb

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09-0501-21

Datenblatt

Bulk 501 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-0501-31

09-0501-31

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2338 10.29
- +

In den Warenkorb

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09-0501-31

Datenblatt

Bulk 501 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-2503-21

10-2503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3181 10.29
- +

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10-2503-21

Datenblatt

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-2503-31

10-2503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2894 10.29
- +

In den Warenkorb

Jetzt anfragen

10-2503-31

Datenblatt

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-2810-90WR

08-2810-90WR

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2926 10.29
- +

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08-2810-90WR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-820-90C

16-820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3947 10.29
- +

In den Warenkorb

Jetzt anfragen

16-820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-822-90C

16-822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2959 10.29
- +

In den Warenkorb

Jetzt anfragen

16-822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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