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Mfr. Teil #	Lagerbestand	Preis	Menge	Datenblatt	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-87-040-11-061101 CONN SOCKET PGA 40POS GOLD Preci-Dip	3503	1.24	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	510	Active	PGA	40 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-012101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	3684	1.10	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-008101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3912	1.07	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-011101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	2507	1.07	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-105161 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	2801	1.08	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-006101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	2485	1.08	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-428-41-001101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2018	1.08	- + In den Warenkorb Jetzt anfragen		Bulk	115	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-009101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	2639	1.08	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-009101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3139	1.08	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-108-41-005101 CONN TRANSIST TO-5 8POS GOLD Preci-Dip	3777	1.12	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	917	Active	Transistor, TO-5	8 (Round)	-	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-108-41-053101 CONN TRANSIST TO-5 8POS GOLD Preci-Dip	3469	1.12	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	917	Active	Transistor, TO-5	8 (Round)	-	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-208-41-005101 CONN TRANSIST TO-5 8POS GOLD Preci-Dip	2015	1.12	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	917	Active	Transistor, TO-5	8 (Round)	-	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-208-41-053101 CONN TRANSIST TO-5 8POS GOLD Preci-Dip	3668	1.12	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	917	Active	Transistor, TO-5	8 (Round)	-	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-316-41-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	2293	1.09	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	614	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-003101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	2461	1.09	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-3513-10 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	3426	1.17	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-314-31-012101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	3748	1.09	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	614	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-312-41-001101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	2461	1.09	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	121	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-320-41-001101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	3060	1.13	- + In den Warenkorb Jetzt anfragen		Bulk	115	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-002101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	3916	1.13	- + In den Warenkorb Jetzt anfragen	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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