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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-87-628-41-005101

117-87-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2402 1.09
- +

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117-87-628-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-312-41-001101

122-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2261 1.10
- +

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122-83-312-41-001101

Datenblatt

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-312-41-001101

123-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2101 1.10
- +

In den Warenkorb

Jetzt anfragen

123-83-312-41-001101

Datenblatt

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-322-41-001101

110-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3720 1.10
- +

In den Warenkorb

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110-83-322-41-001101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-322-41-001151

110-83-322-41-001151

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2296 1.10
- +

In den Warenkorb

Jetzt anfragen

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-422-41-001101

110-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2320 1.10
- +

In den Warenkorb

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110-83-422-41-001101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-013101

116-87-306-41-013101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2713 1.10
- +

In den Warenkorb

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116-87-306-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-322-41-105101

110-87-322-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2604 1.10
- +

In den Warenkorb

Jetzt anfragen

110-87-322-41-105101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-322-41-001101

614-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2882 1.10
- +

In den Warenkorb

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614-87-322-41-001101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-422-41-001101

614-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2597 1.10
- +

In den Warenkorb

Jetzt anfragen

614-87-422-41-001101

Datenblatt

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-105101

110-83-316-41-105101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2338 1.14
- +

In den Warenkorb

Jetzt anfragen

110-83-316-41-105101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-003101

116-83-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3900 1.11
- +

In den Warenkorb

Jetzt anfragen

116-83-314-41-003101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-314-41-036101

146-87-314-41-036101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2488 1.11
- +

In den Warenkorb

Jetzt anfragen

146-87-314-41-036101

Datenblatt

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-306-10-001101

299-83-306-10-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2737 1.11
- +

In den Warenkorb

Jetzt anfragen

299-83-306-10-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-0518-10H

08-0518-10H

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2221 1.19
- +

In den Warenkorb

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08-0518-10H

Datenblatt

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-10H

08-1518-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2896 1.19
- +

In den Warenkorb

Jetzt anfragen

08-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-83-316-41-001101

612-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3817 1.16
- +

In den Warenkorb

Jetzt anfragen

612-83-316-41-001101

Datenblatt

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SMPX-44LCC-N

SMPX-44LCC-N

SMT PLCC SOCKET 44P NON POLARISE

Kycon, Inc.

2398 1.20
- +

In den Warenkorb

Jetzt anfragen

SMPX-44LCC-N

Datenblatt

Tube SMPX Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
SMPX-44LCC-P

SMPX-44LCC-P

SMT PLCC SOCKET 44P POLARISED RO

Kycon, Inc.

2539 1.20
- +

In den Warenkorb

Jetzt anfragen

SMPX-44LCC-P

Datenblatt

Tube SMPX Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
917-87-210-41-005101

917-87-210-41-005101

CONN TRANSIST TO-5 10POS GOLD

Preci-Dip

3501 1.15
- +

In den Warenkorb

Jetzt anfragen

917-87-210-41-005101

Datenblatt

Bulk 917 Active Transistor, TO-5 10 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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