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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-0518-11

20-0518-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2706 3.44
- +

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20-0518-11

Datenblatt

Bulk 518 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-1518-11

20-1518-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3146 3.44
- +

In den Warenkorb

Jetzt anfragen

20-1518-11

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-650-41-005101

110-83-650-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3613 3.25
- +

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110-83-650-41-005101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-314-T-A1

APA-314-T-A1

ADAPTER PLUG

Samtec Inc.

2628 3.46
- +

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Bulk APA Active - 14 (2 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
124-83-422-41-002101

124-83-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2300 3.25
- +

In den Warenkorb

Jetzt anfragen

Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-108-12-051101

510-87-108-12-051101

CONN SOCKET PGA 108POS GOLD

Preci-Dip

3615 3.26
- +

In den Warenkorb

Jetzt anfragen

510-87-108-12-051101

Datenblatt

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-6513-10

16-6513-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3176 3.47
- +

In den Warenkorb

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16-6513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0513-11

13-0513-11

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3033 3.47
- +

In den Warenkorb

Jetzt anfragen

13-0513-11

Datenblatt

Bulk 0513 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-10T

27-0518-10T

CONN SOCKET SIP 27POS GOLD

Aries Electronics

3640 3.47
- +

In den Warenkorb

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27-0518-10T

Datenblatt

Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-87-320-11-001101

299-87-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3100 3.27
- +

In den Warenkorb

Jetzt anfragen

299-87-320-11-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-44-032-17-400004

540-44-032-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

2579 3.49
- +

In den Warenkorb

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540-44-032-17-400004

Datenblatt

Tape & Reel (TR) 540 Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS)
299-87-614-10-002101

299-87-614-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3596 3.28
- +

In den Warenkorb

Jetzt anfragen

299-87-614-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-006101

116-87-652-41-006101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2241 3.38
- +

In den Warenkorb

Jetzt anfragen

116-87-652-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
25-0513-10T

25-0513-10T

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2418 3.50
- +

In den Warenkorb

Jetzt anfragen

25-0513-10T

Datenblatt

Bulk 0513 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-109-12-051101

510-87-109-12-051101

CONN SOCKET PGA 109POS GOLD

Preci-Dip

3367 3.29
- +

In den Warenkorb

Jetzt anfragen

510-87-109-12-051101

Datenblatt

Bulk 510 Active PGA 109 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-648-41-117101

114-83-648-41-117101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3579 3.30
- +

In den Warenkorb

Jetzt anfragen

114-83-648-41-117101

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-018101

116-83-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3797 3.30
- +

In den Warenkorb

Jetzt anfragen

116-83-636-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-011101

116-83-324-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2249 3.62
- +

In den Warenkorb

Jetzt anfragen

116-83-324-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-432-41-035101

146-83-432-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3853 3.31
- +

In den Warenkorb

Jetzt anfragen

146-83-432-41-035101

Datenblatt

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-432-41-036101

146-83-432-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2517 3.31
- +

In den Warenkorb

Jetzt anfragen

146-83-432-41-036101

Datenblatt

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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