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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
214-44-316-01-670799

214-44-316-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

2191 3.52
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Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
214-99-316-01-670799

214-99-316-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

3796 3.52
- +

In den Warenkorb

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Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
714-43-112-31-018000

714-43-112-31-018000

CONN SOCKET SIP 12POS GOLD

Mill-Max Manufacturing Corp.

2410 3.53
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714-43-112-31-018000

Datenblatt

Tube 714 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
11-0513-11H

11-0513-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2663 3.53
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11-0513-11H

Datenblatt

Bulk 0513 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0513-11

16-0513-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2082 3.53
- +

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16-0513-11

Datenblatt

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0503-20

06-0503-20

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2420 3.53
- +

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06-0503-20

Datenblatt

Bulk 0503 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
06-0503-30

06-0503-30

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3856 3.53
- +

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06-0503-30

Datenblatt

Bulk 0503 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
15-0518-00

15-0518-00

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2019 3.56
- +

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15-0518-00

Datenblatt

Bulk 518 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0518-11H

12-0518-11H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2528 3.56
- +

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12-0518-11H

Datenblatt

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-11H

12-1518-11H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2583 3.56
- +

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12-1518-11H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-314-T-A

APA-314-T-A

ADAPTER PLUG

Samtec Inc.

3329 3.57
- +

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Bulk APA Active - 14 (2 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
28-0518-10T

28-0518-10T

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2897 3.58
- +

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28-0518-10T

Datenblatt

Bulk 518 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-10T

28-1518-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2499 3.58
- +

In den Warenkorb

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28-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-118-41-013000

346-93-118-41-013000

CONN SOCKET SIP 18POS GOLD

Mill-Max Manufacturing Corp.

3802 3.58
- +

In den Warenkorb

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346-93-118-41-013000

Datenblatt

Bulk 346 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-118-41-013000

346-43-118-41-013000

CONN SOCKET SIP 18POS GOLD

Mill-Max Manufacturing Corp.

3514 3.58
- +

In den Warenkorb

Jetzt anfragen

346-43-118-41-013000

Datenblatt

Bulk 346 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-3518-10H

16-3518-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2166 3.58
- +

In den Warenkorb

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16-3518-10H

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-652-41-005101

110-83-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2285 3.38
- +

In den Warenkorb

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110-83-652-41-005101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-308-T-B

APA-308-T-B

ADAPTER PLUG

Samtec Inc.

2927 3.60
- +

In den Warenkorb

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Bulk APA Active - 8 (2 x 4) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
08-6511-10

08-6511-10

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3779 3.61
- +

In den Warenkorb

Jetzt anfragen

08-6511-10

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3513-11

16-3513-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2114 3.61
- +

In den Warenkorb

Jetzt anfragen

16-3513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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