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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-83-650-41-001101

115-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3025 3.31
- +

In den Warenkorb

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Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-950-41-001101

115-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3576 3.41
- +

In den Warenkorb

Jetzt anfragen

Bulk 115 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-013101

116-87-316-41-013101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2806 3.32
- +

In den Warenkorb

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116-87-316-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-011101

116-83-422-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3302 3.32
- +

In den Warenkorb

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116-83-422-41-011101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-950-41-005101

110-83-950-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2092 3.34
- +

In den Warenkorb

Jetzt anfragen

110-83-950-41-005101

Datenblatt

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-004101

116-87-324-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2553 3.34
- +

In den Warenkorb

Jetzt anfragen

116-87-324-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-004101

116-87-424-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2488 3.34
- +

In den Warenkorb

Jetzt anfragen

116-87-424-41-004101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-640-41-105101

110-83-640-41-105101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2780 3.35
- +

In den Warenkorb

Jetzt anfragen

110-83-640-41-105101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-648-31-012101

614-87-648-31-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2437 3.35
- +

In den Warenkorb

Jetzt anfragen

614-87-648-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-018101

116-87-650-41-018101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3846 3.45
- +

In den Warenkorb

Jetzt anfragen

116-87-650-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-324-41-001101

123-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3919 3.36
- +

In den Warenkorb

Jetzt anfragen

123-83-324-41-001101

Datenblatt

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-648-41-105101

117-87-648-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2056 3.36
- +

In den Warenkorb

Jetzt anfragen

117-87-648-41-105101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-318-11-001101

299-83-318-11-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2525 3.36
- +

In den Warenkorb

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299-83-318-11-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
21-0513-10

21-0513-10

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2455 3.51
- +

In den Warenkorb

Jetzt anfragen

21-0513-10

Datenblatt

Bulk 0513 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0513-10H

15-0513-10H

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2702 3.51
- +

In den Warenkorb

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15-0513-10H

Datenblatt

Bulk 0513 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0513-10T

23-0513-10T

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2143 3.51
- +

In den Warenkorb

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23-0513-10T

Datenblatt

Bulk 0513 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-10H

25-0518-10H

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2608 3.51
- +

In den Warenkorb

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25-0518-10H

Datenblatt

Bulk 518 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-0518-10

30-0518-10

CONN SOCKET SIP 30POS GOLD

Aries Electronics

2614 3.51
- +

In den Warenkorb

Jetzt anfragen

30-0518-10

Datenblatt

Bulk 518 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-1518-10

30-1518-10

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3246 3.51
- +

In den Warenkorb

Jetzt anfragen

30-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0517-90C

08-0517-90C

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2385 3.51
- +

In den Warenkorb

Jetzt anfragen

08-0517-90C

Datenblatt

Bulk 0517 Active SIP 8 (1 x 8) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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