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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-640-41-006101

116-83-640-41-006101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3996 3.49
- +

In den Warenkorb

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116-83-640-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
214-44-318-01-670799

214-44-318-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

3900 3.71
- +

In den Warenkorb

Jetzt anfragen

Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
214-99-318-01-670799

214-99-318-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

3512 3.71
- +

In den Warenkorb

Jetzt anfragen

Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
4594

4594

CONN SOCKET TRANSIST TO100 10POS

Keystone Electronics

3858 3.72
- +

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4594

Datenblatt

Bulk - Active Transistor, TO-100 10 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
14-0513-11

14-0513-11

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2755 3.73
- +

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14-0513-11

Datenblatt

Bulk 0513 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0513-10H

16-0513-10H

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2200 3.73
- +

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16-0513-10H

Datenblatt

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3518-01

06-3518-01

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2737 3.73
- +

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06-3518-01

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-10T

29-0518-10T

CONN SOCKET SIP 29POS GOLD

Aries Electronics

3083 3.73
- +

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29-0518-10T

Datenblatt

Bulk 518 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-0518-10

32-0518-10

CONN SOCKET SIP 32POS GOLD

Aries Electronics

3204 3.73
- +

In den Warenkorb

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32-0518-10

Datenblatt

Bulk 518 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-1518-10

32-1518-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2774 3.73
- +

In den Warenkorb

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32-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0508-21

04-0508-21

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2255 3.73
- +

In den Warenkorb

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04-0508-21

Datenblatt

Bulk 508 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
04-0508-31

04-0508-31

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2952 3.73
- +

In den Warenkorb

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04-0508-31

Datenblatt

Bulk 508 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
04-1508-21

04-1508-21

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3996 3.73
- +

In den Warenkorb

Jetzt anfragen

04-1508-21

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
04-1508-31

04-1508-31

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3123 3.73
- +

In den Warenkorb

Jetzt anfragen

04-1508-31

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
214-99-320-01-670799

214-99-320-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

3629 3.74
- +

In den Warenkorb

Jetzt anfragen

Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
214-44-320-01-670799

214-44-320-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

2776 3.74
- +

In den Warenkorb

Jetzt anfragen

Tape & Reel (TR) 214 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
146-87-640-41-035101

146-87-640-41-035101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2993 3.85
- +

In den Warenkorb

Jetzt anfragen

146-87-640-41-035101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-640-41-036101

146-87-640-41-036101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2636 3.85
- +

In den Warenkorb

Jetzt anfragen

146-87-640-41-036101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2C-2015

XR2C-2015

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

2203 3.74
- +

In den Warenkorb

Jetzt anfragen

XR2C-2015

Datenblatt

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
510-83-069-11-001101

510-83-069-11-001101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

3105 3.51
- +

In den Warenkorb

Jetzt anfragen

510-83-069-11-001101

Datenblatt

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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