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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
04-820-90C

04-820-90C

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3456 4.42
- +

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04-820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-822-90C

04-822-90C

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2525 4.42
- +

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04-822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-823-90C

04-823-90C

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2257 4.42
- +

In den Warenkorb

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04-823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-135-14-051101

510-87-135-14-051101

CONN SOCKET PGA 135POS GOLD

Preci-Dip

3708 4.19
- +

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510-87-135-14-051101

Datenblatt

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-43-428-41-005000

117-43-428-41-005000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3771 4.43
- +

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117-43-428-41-005000

Datenblatt

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-3513-10H

16-3513-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3732 4.43
- +

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16-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-318-T-A1

APA-318-T-A1

ADAPTER PLUG

Samtec Inc.

3345 4.44
- +

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Bulk APA Active - 18 (2 x 9) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
299-83-616-10-002101

299-83-616-10-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3529 4.48
- +

In den Warenkorb

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299-83-616-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-012101

116-87-652-41-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3609 4.33
- +

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116-87-652-41-012101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-4513-11H

10-4513-11H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3459 4.44
- +

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10-4513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6513-11

16-6513-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2469 4.44
- +

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16-6513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-11

26-0518-11

CONN SOCKET SIP 26POS GOLD

Aries Electronics

3967 4.44
- +

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26-0518-11

Datenblatt

Bulk 518 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-0518-10H

32-0518-10H

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2429 4.44
- +

In den Warenkorb

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32-0518-10H

Datenblatt

Bulk 518 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-1518-10H

32-1518-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2242 4.44
- +

In den Warenkorb

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32-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-636-41-007101

116-83-636-41-007101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3923 4.21
- +

In den Warenkorb

Jetzt anfragen

116-83-636-41-007101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-088-12-051101

510-83-088-12-051101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

2889 4.21
- +

In den Warenkorb

Jetzt anfragen

510-83-088-12-051101

Datenblatt

Bulk 510 Active PGA 88 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-088-12-052101

510-83-088-12-052101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

2678 4.21
- +

In den Warenkorb

Jetzt anfragen

510-83-088-12-052101

Datenblatt

Bulk 510 Active PGA 88 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-088-13-001101

510-83-088-13-001101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

2722 4.21
- +

In den Warenkorb

Jetzt anfragen

510-83-088-13-001101

Datenblatt

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-088-13-062101

510-83-088-13-062101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

3577 4.21
- +

In den Warenkorb

Jetzt anfragen

510-83-088-13-062101

Datenblatt

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-088-13-081101

510-83-088-13-081101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

3720 4.21
- +

In den Warenkorb

Jetzt anfragen

510-83-088-13-081101

Datenblatt

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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