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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-3518-10M

18-3518-10M

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2396 4.56
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18-3518-10M

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-952-41-001101

614-83-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3952 4.30
- +

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614-83-952-41-001101

Datenblatt

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-009101

116-87-642-41-009101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2571 4.30
- +

In den Warenkorb

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116-87-642-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-096-11-041101

510-83-096-11-041101

CONN SOCKET PGA 96POS GOLD

Preci-Dip

3002 4.60
- +

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510-83-096-11-041101

Datenblatt

Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-018101

116-83-650-41-018101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3295 4.58
- +

In den Warenkorb

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116-83-650-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-143-15-081101

510-87-143-15-081101

CONN SOCKET PGA 143POS GOLD

Preci-Dip

3468 4.31
- +

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510-87-143-15-081101

Datenblatt

Bulk 510 Active PGA 143 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-123-41-013000

346-93-123-41-013000

CONN SOCKET SIP 23POS GOLD

Mill-Max Manufacturing Corp.

3457 4.57
- +

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346-93-123-41-013000

Datenblatt

Bulk 346 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-123-41-013000

346-43-123-41-013000

CONN SOCKET SIP 23POS GOLD

Mill-Max Manufacturing Corp.

2882 4.57
- +

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346-43-123-41-013000

Datenblatt

Bulk 346 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-318-T-A

APA-318-T-A

ADAPTER PLUG

Samtec Inc.

2039 4.57
- +

In den Warenkorb

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Bulk APA Active - 18 (2 x 9) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-83-648-41-006101

116-83-648-41-006101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3549 4.32
- +

In den Warenkorb

Jetzt anfragen

116-83-648-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
34-3513-10

34-3513-10

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3629 4.58
- +

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34-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0508-21

05-0508-21

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3496 4.58
- +

In den Warenkorb

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05-0508-21

Datenblatt

Bulk 508 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
05-0508-31

05-0508-31

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2592 4.58
- +

In den Warenkorb

Jetzt anfragen

05-0508-31

Datenblatt

Bulk 508 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
116-83-648-41-003101

116-83-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2473 4.60
- +

In den Warenkorb

Jetzt anfragen

116-83-648-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
940-44-044-17-400004

940-44-044-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

2590 4.60
- +

In den Warenkorb

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940-44-044-17-400004

Datenblatt

Tape & Reel (TR) 940 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS)
APA-314-T-N

APA-314-T-N

ADAPTER PLUG

Samtec Inc.

3531 4.61
- +

In den Warenkorb

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Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-87-144-15-081101

510-87-144-15-081101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

3883 4.34
- +

In den Warenkorb

Jetzt anfragen

510-87-144-15-081101

Datenblatt

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-648-41-035101

146-87-648-41-035101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2822 4.34
- +

In den Warenkorb

Jetzt anfragen

146-87-648-41-035101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-648-41-036101

146-87-648-41-036101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2461 4.34
- +

In den Warenkorb

Jetzt anfragen

146-87-648-41-036101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-618-10-002101

299-87-618-10-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3837 4.35
- +

In den Warenkorb

Jetzt anfragen

299-87-618-10-002101

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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