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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
217-83-764-41-005101

217-83-764-41-005101

DIL SOLDER TAIL 1.778MM

Preci-Dip

3716 4.38
- +

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- 217 Active - - - - - - - - - - - - - -
117-83-668-41-005101

117-83-668-41-005101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip

2350 4.26
- +

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117-83-668-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
HLS-0104-G-3

HLS-0104-G-3

.100 SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2604 4.52
- +

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Tube HLS Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic
714-43-214-31-018000

714-43-214-31-018000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3969 4.53
- +

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714-43-214-31-018000

Datenblatt

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-640-41-012101

116-83-640-41-012101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2033 4.27
- +

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116-83-640-41-012101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
36-1518-10T

36-1518-10T

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2256 4.53
- +

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36-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
39-0518-10

39-0518-10

CONN SOCKET SIP 39POS GOLD

Aries Electronics

3184 4.53
- +

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39-0518-10

Datenblatt

Bulk 518 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-089-12-051101

510-83-089-12-051101

CONN SOCKET PGA 89POS GOLD

Preci-Dip

3150 4.26
- +

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510-83-089-12-051101

Datenblatt

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-089-13-082101

510-83-089-13-082101

CONN SOCKET PGA 89POS GOLD

Preci-Dip

2197 4.26
- +

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510-83-089-13-082101

Datenblatt

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-12-051101

510-83-084-12-051101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3537 4.27
- +

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510-83-084-12-051101

Datenblatt

Bulk 510 Active PGA 84 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-13-081101

510-83-084-13-081101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3095 4.27
- +

In den Warenkorb

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510-83-084-13-081101

Datenblatt

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-13-082101

510-83-084-13-082101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2864 4.27
- +

In den Warenkorb

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510-83-084-13-082101

Datenblatt

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-006101

116-83-652-41-006101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3036 4.54
- +

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116-83-652-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-964-41-005101

110-83-964-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2586 4.28
- +

In den Warenkorb

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110-83-964-41-005101

Datenblatt

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-324-10-001101

299-87-324-10-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3822 4.28
- +

In den Warenkorb

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299-87-324-10-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-064-01-505101

110-83-064-01-505101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3351 4.28
- +

In den Warenkorb

Jetzt anfragen

110-83-064-01-505101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
19-0518-00

19-0518-00

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3289 4.56
- +

In den Warenkorb

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19-0518-00

Datenblatt

Bulk 518 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
33-0518-10H

33-0518-10H

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2395 4.56
- +

In den Warenkorb

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33-0518-10H

Datenblatt

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-0518-10T

36-0518-10T

CONN SOCKET SIP 36POS GOLD

Aries Electronics

2105 4.56
- +

In den Warenkorb

Jetzt anfragen

36-0518-10T

Datenblatt

Bulk 518 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-648-31-012101

614-83-648-31-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3342 4.28
- +

In den Warenkorb

Jetzt anfragen

614-83-648-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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