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Foto Mfr. Teil # Lagerbestand Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
05-0513-10H

05-0513-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3171 1.25
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05-0513-10H

Datenblatt

Bulk 0513 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0503-20

02-0503-20

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2990 1.25
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02-0503-20

Datenblatt

Bulk 0503 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
02-0503-30

02-0503-30

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3439 1.25
- +

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02-0503-30

Datenblatt

Bulk 0503 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
09-0518-10T

09-0518-10T

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2223 1.25
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09-0518-10T

Datenblatt

Bulk 518 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-10

10-1518-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2797 1.25
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10-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-420-41-018101

116-87-420-41-018101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3315 1.34
- +

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116-87-420-41-018101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-006101

116-87-322-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2187 1.18
- +

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116-87-322-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-628-41-003101

115-87-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2988 1.35
- +

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115-87-628-41-003101

Datenblatt

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-009101

116-87-314-41-009101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2378 1.23
- +

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116-87-314-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
4603

4603

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

2929 1.26
- +

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4603

Datenblatt

Bulk - Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
116-87-316-41-007101

116-87-316-41-007101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3509 1.23
- +

In den Warenkorb

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116-87-316-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-420-31-012101

614-87-420-31-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2758 1.19
- +

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614-87-420-31-012101

Datenblatt

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-006101

116-83-316-41-006101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3263 1.19
- +

In den Warenkorb

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116-83-316-41-006101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-636-41-005101

110-87-636-41-005101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2041 1.39
- +

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110-87-636-41-005101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 48-HZL/01-TT

AR 48-HZL/01-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

2416 1.26
- +

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AR 48-HZL/01-TT

Datenblatt

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
06-3518-10M

06-3518-10M

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3957 1.27
- +

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06-3518-10M

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
4602

4602

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

2538 1.27
- +

In den Warenkorb

Jetzt anfragen

4602

Datenblatt

Bulk - Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
08-0513-10T

08-0513-10T

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2819 1.27
- +

In den Warenkorb

Jetzt anfragen

08-0513-10T

Datenblatt

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-11

07-0518-11

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2481 1.27
- +

In den Warenkorb

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07-0518-11

Datenblatt

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
PX-32LCC

PX-32LCC

LEADLESS CHIP CARRIER 32P PBT RO

Kycon, Inc.

3946 1.27
- +

In den Warenkorb

Jetzt anfragen

Tube PX Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
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